Fengkui Cao

Orcid: 0000-0002-5869-7352

According to our database1, Fengkui Cao authored at least 13 papers between 2021 and 2026.

Collaborative distances:
  • Dijkstra number2 of four.
  • Erdős number3 of four.

Timeline

Legend:

Book  In proceedings  Article  PhD thesis  Dataset  Other 

Links

On csauthors.net:

Bibliography

2026
CAD-Mesher: A Convenient, Accurate, Dense Mesh-Based Mapping Module in SLAM for Dynamic Environments.
IEEE Trans. Multim., 2026

2025
Robust Ground Constrained SLAM for Mobile Robot With Sparse-Channel LiDAR.
IEEE Trans. Intell. Veh., May, 2025

SGT-LLC: LiDAR Loop Closing Based on Semantic Graph With Triangular Spatial Topology.
IEEE Robotics Autom. Lett., April, 2025

BEV-LSLAM: A Novel and Compact BEV LiDAR SLAM for Outdoor Environment.
IEEE Robotics Autom. Lett., March, 2025

TRLO: An Efficient LiDAR Odometry With 3-D Dynamic Object Tracking and Removal.
IEEE Trans. Instrum. Meas., 2025

Fusion Scene Context: Robust and Efficient LiDAR Place Recognition Across Season.
Proceedings of the IEEE/RSJ International Conference on Intelligent Robots and Systems, 2025

2024
ScorePillar: A Real-Time Small Object Detection Method Based on Pillar Scoring of Lidar Measurement.
IEEE Trans. Instrum. Meas., 2024

Auxiliary Linear Extended State Observer for Position Tracking Control of PMSM Based on Sliding Mode Control.
Proceedings of the 14th Asian Control Conference, 2024

Twin-Motor Servo Drive Control Based on RL and Perturbation Observer.
Proceedings of the 14th Asian Control Conference, 2024

Comprehensive Suppression Method of Mechanical Resonance and Disturbance in Servo System.
Proceedings of the 14th Asian Control Conference, 2024

A Semantic-Assisted LiDAR SLAM Based on Attention Feature Points.
Proceedings of the 14th Asian Control Conference, 2024

2023
An End-to-End Localizer for Long-Term Topological Localization in Large-Scale Changing Environments.
IEEE Trans. Ind. Electron., 2023

2021
Season-Invariant and Viewpoint-Tolerant LiDAR Place Recognition in GPS-Denied Environments.
IEEE Trans. Ind. Electron., 2021


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