Fenglian Sun

According to our database, Fenglian Sun authored at least 5 papers between 2008 and 2018.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of five.

2018

A new hermetic sealing method for ceramic package using nanosilver sintering technology.

Hao Zhang, Yang Liu, Lingen Wang, Jiajie Fan, Xuejun Fan, Fenglian Sun, Guoqi Zhang

Microelectron. Reliab., 2018

2015

Interfacial reaction and failure mode analysis of the solder joints for flip-chip LED on ENIG and Cu-OSP surface finishes.

Yang Liu, Fenglian Sun, Hao Zhang, Tong Xin, Cadmus A. Yuan, Guoqi Zhang

Microelectron. Reliab., 2015

2014

Evaluating board level solder interconnects reliability using vibration test methods.

Yang Liu, Fenglian Sun, Hongwu Zhang, J. Wang, Zhen Zhou

Microelectron. Reliab., 2014

Thermal and mechanical effects of voids within flip chip soldering in LED packages.

Yang Liu, Stanley Y. Y. Leung, Jia Zhao, Cell K. Y. Wong, Cadmus A. Yuan, Guoqi Zhang, Fenglian Sun, Liangliang Luo

Microelectron. Reliab., 2014

2008

Fracture morphology and mechanism of IMC in Low-Ag SAC Solder/UBM (Ni(P)-Au) for WLCSP.

Fenglian Sun, Hendrik Pieter Hochstenbach, Willem D. van Driel, G. Q. (Kouchi) Zhang

Microelectron. Reliab., 2008