Hendrik Pieter Hochstenbach

According to our database, Hendrik Pieter Hochstenbach authored at least 3 papers between 2008 and 2010.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of five.

2010

Designing for reliability using a new Wafer Level Package structure.

Hendrik Pieter Hochstenbach, Willem D. van Driel, Dao-Guo Yang, Jeroen J. M. Zaal, E. Bagerman

Microelectron. Reliab., 2010

2009

Solder interconnect reliability under drop impact loading conditions using High-speed Cold Bump Pull.

Jeroen J. M. Zaal, Hendrik Pieter Hochstenbach, Willem D. van Driel, G. Q. Zhang

Microelectron. Reliab., 2009

2008

Fracture morphology and mechanism of IMC in Low-Ag SAC Solder/UBM (Ni(P)-Au) for WLCSP.

Fenglian Sun, Hendrik Pieter Hochstenbach, Willem D. van Driel, G. Q. (Kouchi) Zhang

Microelectron. Reliab., 2008