H. J. L. Bressers

According to our database, H. J. L. Bressers authored at least 5 papers in 2007.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of five.

2007

Numerical modeling of warpage induced in QFN array molding process.

Dao-Guo Yang, Kaspar M. B. Jansen, Leo J. Ernst, G. Q. Zhang, W. D. van Driel, H. J. L. Bressers, J. H. J. Janssen

Microelectron. Reliab., 2007

Effect of filler concentration of rubbery shear and bulk modulus of molding compounds.

Dao-Guo Yang, Kaspar M. B. Jansen, Leo J. Ernst, G. Q. Zhang, H. J. L. Bressers, J. H. J. Janssen

Microelectron. Reliab., 2007

Novel shear tools for viscoelastic characterization of packaging polymers.

C. van't Hof, Kaspar M. B. Jansen, G. Wisse, Leo J. Ernst, Dao-Guo Yang, G. Q. Zhang, H. J. L. Bressers

Microelectron. Reliab., 2007

Virtual qualification of moisture induced failures of advanced packages.

Marcel A. J. van Gils, W. D. van Driel, G. Q. Zhang, H. J. L. Bressers, Richard B. R. van Silfhout, X. J. Fan, J. H. J. Janssen

Microelectron. Reliab., 2007

Correlation between chemistry of polymer building blocks and microelectronics reliability.

H. J. L. Bressers, W. D. van Driel, Kaspar M. B. Jansen, Leo J. Ernst, G. Q. Zhang

Microelectron. Reliab., 2007