Hsien-Ching Hsieh

According to our database1, Hsien-Ching Hsieh authored at least 9 papers between 2011 and 2014.

Collaborative distances:
  • Dijkstra number2 of five.
  • Erdős number3 of five.

Timeline

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Links

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Bibliography

2014
3-D stacked memory system architecture exploration by esl virtual platform and reconfigurable stacking memory architecture in 3D-DSP SoC system.
Proceedings of the IEEE International Conference on Acoustics, 2014

2013
A case study: 3-D stacked memory system architecture exploration by ESL virtual platform.
Proceedings of the 2013 International Symposium on VLSI Design, Automation, and Test, 2013

Low power 3-D stacking multimedia platform with reconfigurable memory architecture.
Proceedings of the Great Lakes Symposium on VLSI 2013 (part of ECRC), 2013

2012
Stacking memory architecture exploration for three-dimensional integrated circuit in 3-D PAC.
Proceedings of the IEEE 25th International SOC Conference, 2012

High resolution and frame rate image signal processor array design for 3-D imager.
Proceedings of the International Symposium on Intelligent Signal Processing and Communications Systems, 2012

Improvement of Multimedia Performance Based on 3-D Stacking Memory Architecture and Software Refinement.
Proceedings of the 14th IEEE International Conference on High Performance Computing and Communication & 9th IEEE International Conference on Embedded Software and Systems, 2012

Low power and high performance 3-D multimedia platform.
Proceedings of the 2012 IEEE Hot Chips 24 Symposium (HCS), 2012

2011
Low power design and dynamic power management system for VLIW DSP subsystem.
Proceedings of the International Symposium on Intelligent Signal Processing and Communications Systems, 2011

System-level design exploration for 3-D stacked memory architectures.
Proceedings of the 9th International Conference on Hardware/Software Codesign and System Synthesis, 2011


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