Jaehwan Ryu
According to our database1,
Jaehwan Ryu authored at least 2 papers
between 2009 and 2026.
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Bibliography
2026
A 28-Gb/mm<sup>2</sup> 4XX-Layer 1-Tb 3-b/Cell WF-Bonding 3D-nand Flash With 5.6-Gb/s/Pin IOs.
IEEE J. Solid State Circuits, January, 2026
2009
Proceedings of the 11th International Conference on Electronic Commerce 2009, 2009