Jianfeng Luo

Affiliations:
  • Synopsys, Inc., Mountain View, CA, USA


According to our database1, Jianfeng Luo authored at least 4 papers between 2005 and 2007.

Collaborative distances:
  • Dijkstra number2 of five.
  • Erdős number3 of four.

Timeline

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Links

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Bibliography

2007
Impact of Modern Process Technologies on the Electrical Parameters of Interconnects.
Proceedings of the 20th International Conference on VLSI Design (VLSI Design 2007), 2007

Model Based Layout Pattern Dependent Metal Filling Algorithm for Improved Chip Surface Uniformity in the Copper Process.
Proceedings of the 12th Conference on Asia South Pacific Design Automation, 2007

2006
An IC manufacturing yield model considering intra-die variations.
Proceedings of the 43rd Design Automation Conference, 2006

2005
A layout dependent full-chip copper electroplating topography model.
Proceedings of the 2005 International Conference on Computer-Aided Design, 2005


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