Juan Boon Tan

According to our database, Juan Boon Tan authored at least 4 papers between 2009 and 2022.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of five.

2022

Insights on Inter-metal Reliability Assessment of High Voltage Interconnects.

Kwang Sing Yew, Ran Xing Ong, Hin Kiong Yap, Wanbing Yi, Jacquelyn Phang, R. Chockalingam, Juan Boon Tan

Proceedings of the IEEE International Reliability Physics Symposium, 2022

2020

3D Geometric Engineering of the Double Wedge-Like Electrodes for Filament-Type RRAM Device Performance Improvement.

Jianxun Sun, Yuan Bo Li, Yiyang Ye, Jun Zhang, Gang Yih Chong, Juan Boon Tan, Zhen Liu, Tupei Chen

IEEE Access, 2020

2010

Design, assembly and reliability of large die and fine-pitch Cu/low-k flip chip package.

Yue Ying Ong, Soon Wee Ho, Kripesh Vaidyanathan, Vasarla Nagendra Sekhar, Ming Chinq Jong, Samuel Lim Yak Long, Vincent Lee Wen Sheng, Leong Ching Wai, Vempati Srinivasa Rao, Jimmy Ong, Xuefen Ong, Xiaowu Zhang, Yoon Uk Seung, John H. Lau, Yeow Kheng Lim, David Yeo, Kai Chong Chan, Yanfeng Zhang, Juan Boon Tan, Dong Kyun Sohn

Microelectron. Reliab., 2010

2009

Underfill selection methodology for fine pitch Cu/low-k FCBGA packages.

Xuefen Ong, Soon Wee Ho, Yue Ying Ong, Leong Ching Wai, Kripesh Vaidyanathan, Yeow Kheng Lim, David Yeo, Kai Chong Chan, Juan Boon Tan, Dong Kyun Sohn, Liang Choo Hsia, Zhong Chen

Microelectron. Reliab., 2009