Vempati Srinivasa Rao

According to our database, Vempati Srinivasa Rao authored at least 4 papers between 2010 and 2023.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of five.

2023

Multi-Chiplet Heterogeneous Integration Packaging for Semiconductor System Scaling.

Surya Bhattacharya, Vempati Srinivasa Rao

Proceedings of the 2023 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits), 2023

2021

Machine-learning based methodologies for 3d x-ray measurement, characterization and optimization for buried structures in advanced ic packages.

Ramanpreet Singh Pahwa, Soon Wee Ho, Ren Qin, Richard Chang, Oo Zaw Min, Jie Wang, Vempati Srinivasa Rao, Tin Lay Nwe, Yanjing Yang, Jens Timo Neumann, Ramani Pichumani, Thomas Gregorich

CoRR, 2021

2015

IME's capabilities and programs in 2.5D/3DIC.

Vempati Srinivasa Rao

Proceedings of the 2015 International 3D Systems Integration Conference, 2015

2010

Design, assembly and reliability of large die and fine-pitch Cu/low-k flip chip package.

Yue Ying Ong, Soon Wee Ho, Kripesh Vaidyanathan, Vasarla Nagendra Sekhar, Ming Chinq Jong, Samuel Lim Yak Long, Vincent Lee Wen Sheng, Leong Ching Wai, Vempati Srinivasa Rao, Jimmy Ong, Xuefen Ong, Xiaowu Zhang, Yoon Uk Seung, John H. Lau, Yeow Kheng Lim, David Yeo, Kai Chong Chan, Yanfeng Zhang, Juan Boon Tan, Dong Kyun Sohn

Microelectron. Reliab., 2010