Soon Wee Ho

According to our database, Soon Wee Ho authored at least 3 papers between 2009 and 2021.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of five.

2021

Machine-learning based methodologies for 3d x-ray measurement, characterization and optimization for buried structures in advanced ic packages.

Ramanpreet Singh Pahwa, Soon Wee Ho, Ren Qin, Richard Chang, Oo Zaw Min, Jie Wang, Vempati Srinivasa Rao, Tin Lay Nwe, Yanjing Yang, Jens Timo Neumann, Ramani Pichumani, Thomas Gregorich

CoRR, 2021

2010

Design, assembly and reliability of large die and fine-pitch Cu/low-k flip chip package.

Yue Ying Ong, Soon Wee Ho, Kripesh Vaidyanathan, Vasarla Nagendra Sekhar, Ming Chinq Jong, Samuel Lim Yak Long, Vincent Lee Wen Sheng, Leong Ching Wai, Vempati Srinivasa Rao, Jimmy Ong, Xuefen Ong, Xiaowu Zhang, Yoon Uk Seung, John H. Lau, Yeow Kheng Lim, David Yeo, Kai Chong Chan, Yanfeng Zhang, Juan Boon Tan, Dong Kyun Sohn

Microelectron. Reliab., 2010

2009

Underfill selection methodology for fine pitch Cu/low-k FCBGA packages.

Xuefen Ong, Soon Wee Ho, Yue Ying Ong, Leong Ching Wai, Kripesh Vaidyanathan, Yeow Kheng Lim, David Yeo, Kai Chong Chan, Juan Boon Tan, Dong Kyun Sohn, Liang Choo Hsia, Zhong Chen

Microelectron. Reliab., 2009