Jun Liu

Orcid: 0009-0009-5326-2657

Affiliations:
  • Hefei University of Technology, School of Computer and Information, China


According to our database1, Jun Liu authored at least 9 papers between 2019 and 2026.

Collaborative distances:
  • Dijkstra number2 of four.
  • Erdős number3 of four.

Timeline

Legend:

Book  In proceedings  Article  PhD thesis  Dataset  Other 

Links

Online presence:

On csauthors.net:

Bibliography

2026
Ring Oscillator-Based PreBond TSV Testing Method With Classification and Grading of Defects.
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., January, 2026

2025
Prebond Test of TSV Based on Voltage Skew Amplification.
IEEE Trans. Circuits Syst. II Express Briefs, November, 2025

A Block-Group-Based Redundant TSV Architecture for Clustered Faults.
IEEE Trans. Very Large Scale Integr. Syst., 2025

2024
Voltage Skew-Based Test Technique for Pre-Bond TSVs in 3-D ICs.
IEEE Trans. Circuits Syst. II Express Briefs, August, 2024

A Self-Biased Current Reference Source-Based Pre-Bond TSV Test Solution.
IEEE Trans. Very Large Scale Integr. Syst., April, 2024

A Symmetric Bridge-Based Pre-Bond TSV Faults Detection Method.
IEEE Trans. Instrum. Meas., 2024

A Scan-Chain-Based Built-in Self-Test for ILV in Monolithic 3-D ICs.
IEEE Trans. Instrum. Meas., 2024

2020
SleepGuardian: An RF-Based Healthcare System Guarding Your Sleep from Afar.
IEEE Netw., 2020

2019
Your WiFi Knows You Fall: A Channel Data-Driven Device-Free Fall Sensing System.
Proceedings of the 2019 IEEE International Conference on Communications, 2019


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