Xianrui Dou

According to our database, Xianrui Dou authored at least 6 papers between 2024 and 2026.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of five.

2026

Ring Oscillator-Based PreBond TSV Testing Method With Classification and Grading of Defects.

Xianrui Dou, Huaguo Liang, Zhengfeng Huang, Yingchun Lu, Tian Chen, Jun Liu

IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., January, 2026

2025

Prebond Test of TSV Based on Voltage Skew Amplification.

Xianrui Dou, Huaguo Liang, Zhengfeng Huang, Yingchun Lu, Yue Wang, Tian Chen, Jun Liu

IEEE Trans. Circuits Syst. II Express Briefs, November, 2025

A TSV Misalignment-Based Repair Architecture in 3-D Chips.

Huaguo Liang, Jiahui Xiao, Xianrui Dou, Tianming Ni, Yingchun Lu, Zhengfeng Huang

IEEE Trans. Very Large Scale Integr. Syst., July, 2025

Pulse-Based Prebond TSV Testing.

Xianrui Dou, Huaguo Liang, Zhengfeng Huang, Yingchun Lu, Tian Chen, Maoxiang Yi

IEEE Trans. Very Large Scale Integr. Syst., May, 2025

A High-Precision Pre-Bond TSV Delay-Fault Detection Technique Using Digitally Controlled Delay Lines.

Zhongyuan Liang, Huaguo Liang, Weikun Chen, Xianrui Dou

Proceedings of the IEEE International Test Conference in Asia, 2025

2024

Machine Learning-Based Diagnosis of Defects in Chiplet Interconnects.

Junming Li, Huaguo Liang, Xianrui Dou, Le Yu, Zhengfeng Huang, Yingchun Lu, Cuiyun Jiang

Proceedings of the International 3D Systems Integration Conference, 2024