Jundong Zhu

According to our database, Jundong Zhu authored at least 3 papers between 2010 and 2025.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of four.

2025

37.4 SHINSAI: A 586mm² Reusable Active TSV Interposer with Programmable Interconnect Fabric and 512Mb 3D Underdeck Memory.

Bo Jiao, Haozhe Zhu, Yuman Zeng, Yongjiang Li, Jie Liao, Siyao Jia, Mochen Tian, Zexing Chen, Jundong Zhu, Dexin Wen, Yan Wang, Yu Wang, Jian Xu, Feng Wang, Jun Tao, Chixiao Chen, Qi Liu, Ming Liu

Proceedings of the IEEE International Solid-State Circuits Conference, 2025

2024

FPIA: Communication-Aware Multi-Chiplet Integration With Field-Programmable Interconnect Fabric on Reusable Silicon Interposer.

Bo Jiao, Lei Xu, Xinyu Yu, Haitao Yang, Haozhe Zhu, Yu Wang, Jundong Zhu, Dexin Wen, Lingli Wang, Jun Tao, Chixiao Chen, Yinhe Han, Qi Liu, Ninghui Sun, Ming Liu

IEEE Trans. Circuits Syst. I Regul. Pap., September, 2024

2010

Study on Applying Vector Representation Based on LabVIEW to the Computing between Direct Lattice and Reciprocal Lattice.

Yingshan Cui, Xiaoli Huang, Lichuan Song, Jundong Zhu

Proceedings of the Information Computing and Applications - International Conference, 2010