Kazuyuki Hozawa

According to our database, Kazuyuki Hozawa authored at least 3 papers between 2010 and 2011.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of five.

2011

Chip-level TSV integration for rapid prototyping of 3D system LSIs.

Kazuyuki Hozawa, Futoshi Furuta, Yuko Hanaoka, Mayu Aoki, Kenichi Takeda, Katsuyuki Sakuma, Kang Wook Lee, Takafumi Fukushima, Mitsumasa Koyanagi

Proceedings of the 2011 IEEE International 3D Systems Integration Conference (3DIC), Osaka, Japan, January 31, 2011

Void reduction in wafer bonding by simultaneously formed ventilation channels.

Mayu Aoki, Kazuyuki Hozawa, Kenichi Takeda

Proceedings of the 2011 IEEE International 3D Systems Integration Conference (3DIC), Osaka, Japan, January 31, 2011

2010

Wafer-level hybrid bonding technology with copper/polymer co-planarization.

Mayu Aoki, Kazuyuki Hozawa, Kenichi Takeda

Proceedings of the IEEE International Conference on 3D System Integration, 2010