Futoshi Furuta

According to our database, Futoshi Furuta authored at least 4 papers between 2008 and 2013.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of four.

2013

Reducing IR drop in 3D integration to less than 1/4 using Buck Converter on Top die (BCT) scheme.

Yasuhiro Shinozuka, Hiroshi Fuketa, Koichi Ishida, Futoshi Furuta, Kenichi Osada, Kenichi Takeda, Makoto Takamiya, Takayasu Sakurai

Proceedings of the International Symposium on Quality Electronic Design, 2013

2011

Chip-level TSV integration for rapid prototyping of 3D system LSIs.

Kazuyuki Hozawa, Futoshi Furuta, Yuko Hanaoka, Mayu Aoki, Kenichi Takeda, Katsuyuki Sakuma, Kang Wook Lee, Takafumi Fukushima, Mitsumasa Koyanagi

Proceedings of the 2011 IEEE International 3D Systems Integration Conference (3DIC), Osaka, Japan, January 31, 2011

6 Tbps/W, 1 Tbps/mm², 3D interconnect using adaptive timing control and low capacitance TSV.

Futoshi Furuta, Kenichi Osada

Proceedings of the 2011 IEEE International 3D Systems Integration Conference (3DIC), Osaka, Japan, January 31, 2011

2008

Superconductor/Semiconductor Hybrid Analog-to-Digital Converter.

Futoshi Furuta, Kazuo Saitoh, Akira Yoshida, Hideo Suzuki

IEICE Trans. Electron., 2008