Kees Beenakker

According to our database1, Kees Beenakker authored at least 7 papers between 2006 and 2014.

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Bibliography

2014
Single-Grain Si Thin-Film Transistors for Monolithic 3D-ICs and Flexible Electronics.
IEICE Trans. Electron., 2014

2012
Test Impact on the Overall Die-to-Wafer 3D Stacked IC Cost.
J. Electron. Test., 2012

2011
Low-temperature bottom-up integration of carbon nanotubes for vertical interconnects in monolithic 3D integrated circuits.
Proceedings of the 2011 IEEE International 3D Systems Integration Conference (3DIC), Osaka, Japan, January 31, 2011

2010
Test Cost Analysis for 3D Die-to-Wafer Stacking.
Proceedings of the 19th IEEE Asian Test Symposium, 2010

Monolithic 3D integration of SRAM and image sensor using two layers of single grain silicon.
Proceedings of the IEEE International Conference on 3D System Integration, 2010

2007
Single-grain Si thin-film transistors for analog and RF circuit applications.
Proceedings of the 33rd European Solid-State Circuits Conference, 2007

2006
A Novel Selected Area Laser Assisted (SALA) System for Crystallization and Doping Processes in Low-Temperature Poly-Si Thin-Film Transistors.
IEICE Trans. Electron., 2006


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