Lorenzo Codecasa
Orcid: 0000-0002-2851-3698
According to our database1,
Lorenzo Codecasa
authored at least 40 papers
between 2004 and 2023.
Collaborative distances:
Collaborative distances:
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Bibliography
2023
Mass lumping the dual cell method to arbitrary polynomial degree for acoustic and electromagnetic waves.
CoRR, 2023
2022
Fast Solution of 3-D Eddy-Current Problems in Multiply Connected Domains by a, v-φ and t-φ Formulations With Multigrid-Based Algorithm for Cohomology Generation.
IEEE Access, 2022
Proceedings of the 17th Conference on Ph.D Research in Microelectronics and Electronics, 2022
2021
An arbitrary-order Cell Method with block-diagonal mass-matrices for the time-dependent 2D Maxwell equations.
J. Comput. Phys., 2021
A Hybrid a-φ Cell Method for Solving Eddy-Current Problems in 3-D Multiply-Connected Domains.
IEEE Access, 2021
2020
A Novel h-φ Approach for Solving Eddy-Current Problems in Multiply Connected Regions.
IEEE Access, 2020
Uncertainty Quantification for SAE J2954 Compliant Static Wireless Charge Components.
IEEE Access, 2020
2019
IEEE Trans. Circuits Syst. I Regul. Pap., 2019
A face-smoothed cell method for static and dynamic piezoelectric coupled problems on polyhedral meshes.
J. Comput. Phys., 2019
Fast Uncertainty Quantification in Low Frequency Electromagnetic Problems by an Integral Equation Method Based on Hierarchical Matrix Compression.
IEEE Access, 2019
2018
Multi-port dynamic compact thermal models of dual-chip package using model order reduction and metaheuristic optimization.
Microelectron. Reliab., 2018
To the special issue constructed from the selected papers of Thermal investigations of integrated circuits and systems, THERMINIC'17.
Microelectron. Reliab., 2018
Versatile MOR-based boundary condition independent compact thermal models with multiple heat sources.
Microelectron. Reliab., 2018
On the Benefit of Adopting Saturable Inductors in Switching-Mode Power-Supplies: A Case Study.
Proceedings of the IEEE International Symposium on Circuits and Systems, 2018
2017
Simulation comparison of InGaP/GaAs HBT thermal performance in wire-bonding and flip-chip technologies.
Microelectron. Reliab., 2017
Microelectron. Reliab., 2017
Microelectron. Reliab., 2017
Model-Order Reduction Procedure for Fast Dynamic Electrothermal Simulation of Power Converters.
Proceedings of the Applications in Electronics Pervading Industry, Environment and Society, 2017
2016
IEEE Trans. Circuits Syst. I Regul. Pap., 2016
Microelectron. Reliab., 2016
2015
Structure-preserving approach to multi-port dynamic compact models of nonlinear heat conduction.
Microelectron. J., 2015
CoRR, 2015
Proceedings of the European Conference on Circuit Theory and Design, 2015
2014
Microelectron. J., 2014
2012
IEEE Trans. Circuits Syst. I Regul. Pap., 2012
IEEE Trans. Circuits Syst. I Regul. Pap., 2012
2010
J. Comput. Phys., 2010
2009
Modeling and Simulation of a Hybrid Photovoltaic Module Equipped With a Heat-Recovery System.
IEEE Trans. Ind. Electron., 2009
Evaluating the effects of temperature gradients and currents nonuniformity in on-chip interconnects.
Microelectron. J., 2009
2008
Steady-state analysis of strongly nonlinear Oscillators By Means of Runge-Kutta Methods.
Proceedings of the International Symposium on Circuits and Systems (ISCAS 2008), 2008
Semi-implicit integration method for the time-domain simulation of thermal responses.
Proceedings of the International Symposium on Circuits and Systems (ISCAS 2008), 2008
2007
IEEE Trans. Circuits Syst. I Regul. Pap., 2007
J. Comput. Phys., 2007
Closed-Form expression of frequency pulling in unlocked-driven nonlinear oscillators.
Proceedings of the 18th European Conference on Circuit Theory and Design, 2007
2006
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 2006
Proceedings of the International Symposium on Circuits and Systems (ISCAS 2006), 2006
2004
Microelectron. J., 2004