Peter J. Zampardi

According to our database, Peter J. Zampardi authored at least 12 papers between 2004 and 2023.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of four.

2023

Improving Performance of InGaP/GaAs HBT Arrays by means of Temperature-Dependent Base Ballasting Resistors.

Ciro Scognamillo, Antonio Pio Catalano, Vincenzo d'Alessandro, Peter J. Zampardi, Kerry Burger

Proceedings of the 18th Conference on Ph.D Research in Microelectronics and Electronics, 2023

2021

From Transistor Parameters to PA Circuit Performance (Invited).

Peter J. Zampardi

Proceedings of the IEEE BiCMOS and Compound Semiconductor Integrated Circuits and Technology Symposium, 2021

2017

Simulation comparison of InGaP/GaAs HBT thermal performance in wire-bonding and flip-chip technologies.

Vincenzo d'Alessandro, Antonio Pio Catalano, Alessandro Magnani, Lorenzo Codecasa, Niccolò Rinaldi, Brian Moser, Peter J. Zampardi

Microelectron. Reliab., 2017

Determination of safe reliability region over temperature and current density for through wafer vias.

Charles S. Whitman, Michael G. Meeder, Peter J. Zampardi

Microelectron. Reliab., 2017

2013

Evaluation of thermal balancing techniques in InGaP/GaAs HBT power arrays for wireless handset power amplifiers.

Andre G. Metzger, Vincenzo d'Alessandro, Niccolò Rinaldi, Peter J. Zampardi

Microelectron. Reliab., 2013

2012

Formulations and a Computer-Aided Test Method for the Estimation of IMD Levels in an Envelope Feedback RFIC Power Amplifier.

Nicolas G. Constantin, Kai H. Kwok, Hongxiao Shao, Cristian Cismaru, Peter J. Zampardi

IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 2012

Measuring seam/crack formation in interconnect metallization.

Peter J. Zampardi, Cristian Cismaru, Hal Banbrook, Bin Li

Microelectron. Reliab., 2012

2010

Will CMOS amplifiers ever Kick-GaAs?

Peter J. Zampardi

Proceedings of the IEEE Custom Integrated Circuits Conference, 2010

2007

An InGaP/GaAs Merged HBT-FET (BiFET) Technology and Applications to the Design of Handset Power Amplifiers.

Andre G. Metzger, Ravi Ramanathan, Jiang Li, Hsiang-Chih Sun, Cristian Cismaru, Hongxiao Shao, Lance Rushing, Kenneth P. Weller, Ce-Jun Wei, Yu Zhu, Alexei Klimashov, Yevgeniy A. Tkachenko, Bin Li, Peter J. Zampardi

IEEE J. Solid State Circuits, 2007

Introduction to the Special Issue on the Third IEEE Compound Semiconductor Integrated Circuit Symposium (CSICS).

Peter Katzin, Peter J. Zampardi

IEEE J. Solid State Circuits, 2007

2006

Characterization, design, modeling, and model validation of silicon-wafer M: N balun components under matched and unmatched conditions.

Francis M. Rotella, Cristian Cismaru, Yevgeniy Gene Tkachenko, Yuhua Cheng, Peter J. Zampardi

IEEE J. Solid State Circuits, 2006

2004

A comparison of linear handset power amplifiers in different bipolar technologies.

Keith Nellis, Peter J. Zampardi

IEEE J. Solid State Circuits, 2004