Vincenzo d'Alessandro

Orcid: 0000-0003-1426-371X

According to our database1, Vincenzo d'Alessandro authored at least 21 papers between 2002 and 2024.

Collaborative distances:
  • Dijkstra number2 of five.
  • Erdős number3 of four.

Timeline

Legend:

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In proceedings 
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PhD thesis 
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Links

Online presence:

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Bibliography

2024
Enhancing Electrical Ruggedness in Double-Sided Cooled Power Modules.
Proceedings of the 19th Conference on Ph.D Research in Microelectronics and Electronics, 2024

2023
Improving Performance of InGaP/GaAs HBT Arrays by means of Temperature-Dependent Base Ballasting Resistors.
Proceedings of the 18th Conference on Ph.D Research in Microelectronics and Electronics, 2023

2022
Investigating the Impact of Cracks on Solar Cells Performance: Analysis Based on Nonuniform and Uniform Crack Distributions.
IEEE Trans. Ind. Informatics, 2022

Defect Detection in Double-Sided Cooled Power Modules by Structure Functions.
Proceedings of the 17th Conference on Ph.D Research in Microelectronics and Electronics, 2022

2018
Multi-port dynamic compact thermal models of dual-chip package using model order reduction and metaheuristic optimization.
Microelectron. Reliab., 2018

Versatile MOR-based boundary condition independent compact thermal models with multiple heat sources.
Microelectron. Reliab., 2018

2017
Si/SiGe: C and InP/GaAsSb Heterojunction Bipolar Transistors for THz Applications.
Proc. IEEE, 2017

Simulation comparison of InGaP/GaAs HBT thermal performance in wire-bonding and flip-chip technologies.
Microelectron. Reliab., 2017

Partition-based approach to parametric dynamic compact thermal modeling.
Microelectron. Reliab., 2017

3-D thermal models calibration by parametric dynamic compact thermal models.
Microelectron. Reliab., 2017

Model-Order Reduction Procedure for Fast Dynamic Electrothermal Simulation of Power Converters.
Proceedings of the Applications in Electronics Pervading Industry, Environment and Society, 2017

2016
Advanced thermal simulation of SiGe: C HBTs including back-end-of-line.
Microelectron. Reliab., 2016

2015
Reliability of high-speed SiGe: C HBT under electrical stress close to the SOA limit.
Microelectron. Reliab., 2015

Structure-preserving approach to multi-port dynamic compact models of nonlinear heat conduction.
Microelectron. J., 2015

2014
3-D electrothermal simulation of active cycling on smart power MOSFETs during short-circuit and UIS conditions.
Microelectron. Reliab., 2014

2013
Analysis of the UIS behavior of power devices by means of SPICE-based electrothermal simulations.
Microelectron. Reliab., 2013

Evaluation of thermal balancing techniques in InGaP/GaAs HBT power arrays for wireless handset power amplifiers.
Microelectron. Reliab., 2013

Dynamic electrothermal macromodeling techniques for thermal-aware design of circuits and systems.
Proceedings of the 2013 23rd International Workshop on Power and Timing Modeling, 2013

2012
Influence of charge balance on the robustness of trench-based super junction diodes.
Microelectron. Reliab., 2012

2004
Extraction and modeling of self-heating and mutual thermal coupling impedance of bipolar transistors.
IEEE J. Solid State Circuits, 2004

2002
Analysis of electro-thermal effects in semiconductor devices.
PhD thesis, 2002


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