Vincenzo d'Alessandro

According to our database, Vincenzo d'Alessandro authored at least 20 papers between 2002 and 2023.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of four.

2023

Improving Performance of InGaP/GaAs HBT Arrays by means of Temperature-Dependent Base Ballasting Resistors.

Ciro Scognamillo, Antonio Pio Catalano, Vincenzo d'Alessandro, Peter J. Zampardi, Kerry Burger

Proceedings of the 18th Conference on Ph.D Research in Microelectronics and Electronics, 2023

2022

Investigating the Impact of Cracks on Solar Cells Performance: Analysis Based on Nonuniform and Uniform Crack Distributions.

Mahmoud Dhimish, Vincenzo d'Alessandro, Santolo Daliento

IEEE Trans. Ind. Informatics, 2022

Defect Detection in Double-Sided Cooled Power Modules by Structure Functions.

Ciro Scognamillo, Antonio Pio Catalano, Vincenzo d'Alessandro, Lorenzo Codecasa, Alberto Castellazzi

Proceedings of the 17th Conference on Ph.D Research in Microelectronics and Electronics, 2022

2018

Multi-port dynamic compact thermal models of dual-chip package using model order reduction and metaheuristic optimization.

Brice Rogié, Lorenzo Codecasa, Eric Monier-Vinard, Valentin Bissuel, Najib Laraqi, Olivier Daniel, Dario D'Amore, Alessandro Magnani, Vincenzo d'Alessandro, Niccolò Rinaldi

Microelectron. Reliab., 2018

Versatile MOR-based boundary condition independent compact thermal models with multiple heat sources.

Lorenzo Codecasa, Robin Bornoff, James Dyson, Vincenzo d'Alessandro, Alessandro Magnani, Niccolò Rinaldi

Microelectron. Reliab., 2018

2017

Si/SiGe: C and InP/GaAsSb Heterojunction Bipolar Transistors for THz Applications.

Pascal Chevalier, Michael Schröter, Colombo R. Bolognesi, Vincenzo d'Alessandro, Maria Alexandrova, Josef Böck, Ralf Flickiger, Sébastien Fregonese, Bernd Heinemann, Christoph Jungemann, Rickard Lovblom, Cristell Maneux, Olivier Ostinelli, Andreas Pawlak, Niccolò Rinaldi, Holger Rücker, Gerald Wedel, Thomas Zimmer

Proc. IEEE, 2017

Simulation comparison of InGaP/GaAs HBT thermal performance in wire-bonding and flip-chip technologies.

Vincenzo d'Alessandro, Antonio Pio Catalano, Alessandro Magnani, Lorenzo Codecasa, Niccolò Rinaldi, Brian Moser, Peter J. Zampardi

Microelectron. Reliab., 2017

Partition-based approach to parametric dynamic compact thermal modeling.

Lorenzo Codecasa, Vincenzo d'Alessandro, Alessandro Magnani, Niccolò Rinaldi, Andre G. Metzger, Robin Bornoff, John Parry

Microelectron. Reliab., 2017

3-D thermal models calibration by parametric dynamic compact thermal models.

Lorenzo Codecasa, Vincenzo d'Alessandro, Alessandro Magnani, Niccolò Rinaldi

Microelectron. Reliab., 2017

Model-Order Reduction Procedure for Fast Dynamic Electrothermal Simulation of Power Converters.

Antonio Pio Catalano, Michele Riccio, Lorenzo Codecasa, Alessandro Magnani, Gianpaolo Romano, Vincenzo d'Alessandro, Luca Maresca, Nils Rinaldi, Giovanni Breglio, Andrea Irace

Proceedings of the Applications in Electronics Pervading Industry, Environment and Society, 2017

2016

Advanced thermal simulation of SiGe: C HBTs including back-end-of-line.

Vincenzo d'Alessandro, Alessandro Magnani, Lorenzo Codecasa, Niccolò Rinaldi, Klaus Aufinger

Microelectron. Reliab., 2016

2015

Reliability of high-speed SiGe: C HBT under electrical stress close to the SOA limit.

Thomas Jacquet, Grazia Sasso, Anjan Chakravorty, Niccolò Rinaldi, Klaus Aufinger, Thomas Zimmer, Vincenzo d'Alessandro, Cristell Maneux

Microelectron. Reliab., 2015

Structure-preserving approach to multi-port dynamic compact models of nonlinear heat conduction.

Lorenzo Codecasa, Vincenzo d'Alessandro, Alessandro Magnani, Niccolò Rinaldi

Microelectron. J., 2015

2014

3-D electrothermal simulation of active cycling on smart power MOSFETs during short-circuit and UIS conditions.

Michele Riccio, Vincenzo d'Alessandro, Andrea Irace, Gilles Rostaing, Mounira Berkani, Stéphane Lefebvre, Philippe Dupuy

Microelectron. Reliab., 2014

2013

Analysis of the UIS behavior of power devices by means of SPICE-based electrothermal simulations.

Vincenzo d'Alessandro, Alessandro Magnani, Michele Riccio, Yohei Iwahashi, Giovanni Breglio, Niccolò Rinaldi, Andrea Irace

Microelectron. Reliab., 2013

Evaluation of thermal balancing techniques in InGaP/GaAs HBT power arrays for wireless handset power amplifiers.

Andre G. Metzger, Vincenzo d'Alessandro, Niccolò Rinaldi, Peter J. Zampardi

Microelectron. Reliab., 2013

Dynamic electrothermal macromodeling techniques for thermal-aware design of circuits and systems.

Alessandro Magnani, Vincenzo d'Alessandro, Niccolò Rinaldi, Massimiliano de Magistris, Klaus Aufinger

Proceedings of the 2013 23rd International Workshop on Power and Timing Modeling, 2013

2012

Influence of charge balance on the robustness of trench-based super junction diodes.

Ana Villamor-Baliarda, Piet Vanmeerbeek, Michele Riccio, Vincenzo d'Alessandro, Andrea Irace, Jaume Roig, David Flores, Peter Moens

Microelectron. Reliab., 2012

2004

Extraction and modeling of self-heating and mutual thermal coupling impedance of bipolar transistors.

Nebojsa Nenadovic, Slobodan Mijalkovic, Lis K. Nanver, Lode K. J. Vandamme, Vincenzo d'Alessandro, Hugo Schellevis, Jan W. Slotboom

IEEE J. Solid State Circuits, 2004

2002

Analysis of electro-thermal effects in semiconductor devices.

Vincenzo d'Alessandro

PhD thesis, 2002