Niccolò Rinaldi

According to our database, Niccolò Rinaldi authored at least 15 papers between 2004 and 2018.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of four.

2018

Multi-port dynamic compact thermal models of dual-chip package using model order reduction and metaheuristic optimization.

Brice Rogié, Lorenzo Codecasa, Eric Monier-Vinard, Valentin Bissuel, Najib Laraqi, Olivier Daniel, Dario D'Amore, Alessandro Magnani, Vincenzo d'Alessandro, Niccolò Rinaldi

Microelectron. Reliab., 2018

Versatile MOR-based boundary condition independent compact thermal models with multiple heat sources.

Lorenzo Codecasa, Robin Bornoff, James Dyson, Vincenzo d'Alessandro, Alessandro Magnani, Niccolò Rinaldi

Microelectron. Reliab., 2018

2017

Si/SiGe: C and InP/GaAsSb Heterojunction Bipolar Transistors for THz Applications.

Pascal Chevalier, Michael Schröter, Colombo R. Bolognesi, Vincenzo d'Alessandro, Maria Alexandrova, Josef Böck, Ralf Flickiger, Sébastien Fregonese, Bernd Heinemann, Christoph Jungemann, Rickard Lovblom, Cristell Maneux, Olivier Ostinelli, Andreas Pawlak, Niccolò Rinaldi, Holger Rücker, Gerald Wedel, Thomas Zimmer

Proc. IEEE, 2017

Simulation comparison of InGaP/GaAs HBT thermal performance in wire-bonding and flip-chip technologies.

Vincenzo d'Alessandro, Antonio Pio Catalano, Alessandro Magnani, Lorenzo Codecasa, Niccolò Rinaldi, Brian Moser, Peter J. Zampardi

Microelectron. Reliab., 2017

Partition-based approach to parametric dynamic compact thermal modeling.

Lorenzo Codecasa, Vincenzo d'Alessandro, Alessandro Magnani, Niccolò Rinaldi, Andre G. Metzger, Robin Bornoff, John Parry

Microelectron. Reliab., 2017

3-D thermal models calibration by parametric dynamic compact thermal models.

Lorenzo Codecasa, Vincenzo d'Alessandro, Alessandro Magnani, Niccolò Rinaldi

Microelectron. Reliab., 2017

2016

Advanced thermal simulation of SiGe: C HBTs including back-end-of-line.

Vincenzo d'Alessandro, Alessandro Magnani, Lorenzo Codecasa, Niccolò Rinaldi, Klaus Aufinger

Microelectron. Reliab., 2016

2015

Reliability of high-speed SiGe: C HBT under electrical stress close to the SOA limit.

Thomas Jacquet, Grazia Sasso, Anjan Chakravorty, Niccolò Rinaldi, Klaus Aufinger, Thomas Zimmer, Vincenzo d'Alessandro, Cristell Maneux

Microelectron. Reliab., 2015

Structure-preserving approach to multi-port dynamic compact models of nonlinear heat conduction.

Lorenzo Codecasa, Vincenzo d'Alessandro, Alessandro Magnani, Niccolò Rinaldi

Microelectron. J., 2015

2013

Analysis of the UIS behavior of power devices by means of SPICE-based electrothermal simulations.

Vincenzo d'Alessandro, Alessandro Magnani, Michele Riccio, Yohei Iwahashi, Giovanni Breglio, Niccolò Rinaldi, Andrea Irace

Microelectron. Reliab., 2013

Evaluation of thermal balancing techniques in InGaP/GaAs HBT power arrays for wireless handset power amplifiers.

Andre G. Metzger, Vincenzo d'Alessandro, Niccolò Rinaldi, Peter J. Zampardi

Microelectron. Reliab., 2013

Dynamic electrothermal macromodeling techniques for thermal-aware design of circuits and systems.

Alessandro Magnani, Vincenzo d'Alessandro, Niccolò Rinaldi, Massimiliano de Magistris, Klaus Aufinger

Proceedings of the 2013 23rd International Workshop on Power and Timing Modeling, 2013

2012

An Experimental Power-Lines Model for Digital ASICs Based on Transmission Lines.

Maurizio Costagliola, Davide De Caro, Antonio Girardi, Roberto Izzi, Niccolò Rinaldi, M. Spirito, P. Spirito

IEEE Trans. Very Large Scale Integr. Syst., 2012

2010

Avalanche multiplication and pinch-in models for simulating electrical instability effects in SiGe HBTs.

Grazia Sasso, Maurizio Costagliola, Niccolò Rinaldi

Microelectron. Reliab., 2010

2004

Analytical Solutions of the Diffusive Heat Equation as the Application for Multi-cellular Device Modeling - A Numerical Aspect.

Zbigniew Lisik, Janusz Wozny, Malgorzata Langer, Niccolò Rinaldi

Proceedings of the Computational Science, 2004