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Lutz Meinshausen

According to our database1, Lutz Meinshausen authored at least 10 papers between 2011 and 2020.

Collaborative distances:
  • Dijkstra number2 of five.
  • Erdős number3 of four.

Timeline

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Links

On csauthors.net:

Bibliography

2020
BEoL Reliability, XPS and REELS Study on low-k Dielectrics to understand Breakdown Mechanisms.
[BibTeX]
[DOI]
Betting Wehring
,
Raik Hoffmann
,
Lukas Gerlich
,
Malte Czernohorsky
,
Benjamin Uhlig
,
Robert Seidel
,
Tobias Barchewitz
,
Frank Schlaphof
,
Lutz Meinshausen
,
Christoph Leyens
Proceedings of the 2020 IEEE International Reliability Physics Symposium, 2020

2018
Evolution and Optimization of BEOL MOM Capacitors Across Advanced CMOS Nodes.
[BibTeX]
[DOI]
Jinglin Shi
,
A. Sidelnicov
,
Kok Wai J. Chew
,
Mei See Chin
,
C. Schippel
,
J. M. M. dos Santos
,
Frank Schlaphof
,
Lutz Meinshausen
,
John R. Long
,
David L. Harame
Proceedings of the 48th European Solid-State Device Research Conference, 2018

2015
Dynamical IMC-growth calculation.
[BibTeX]
[DOI]
Lutz Meinshausen
,
Kirsten Weide-Zaage
,
Hélène Frémont
Microelectron. Reliab., 2015

Electro- and thermomigration induced Cu<sub>3</sub>Sn and Cu<sub>6</sub>Sn<sub>5</sub> formation in SnAg<sub>3.0</sub>Cu<sub>0.5</sub> bumps.
[BibTeX]
[DOI]
Lutz Meinshausen
,
Hélène Frémont
,
Kirsten Weide-Zaage
,
Bernard Plano
Microelectron. Reliab., 2015

2013
Dynamic simulation of migration induced failure mechanism in integrated circuit interconnects.
[BibTeX]
[DOI]
Aymen Moujbani
,
Jörg Kludt
,
Kirsten Weide-Zaage
,
Markus Ackermann
,
Verena Hein
,
Lutz Meinshausen
Microelectron. Reliab., 2013

Electro- and thermomigration-induced IMC formation in SnAg<sub>3.0</sub>Cu<sub>0.5</sub> solder joints on nickel gold pads.
[BibTeX]
[DOI]
Lutz Meinshausen
,
Hélène Frémont
,
Kirsten Weide-Zaage
,
Bernard Plano
Microelectron. Reliab., 2013

2012
Electro- and thermo-migration induced failure mechanisms in Package on Package.
[BibTeX]
[DOI]
Lutz Meinshausen
,
Kirsten Weide-Zaage
,
Hélène Frémont
Microelectron. Reliab., 2012

Migration induced IMC formation in SAC305 solder joints on Cu, NiAu and NiP metal layers.
[BibTeX]
[DOI]
Lutz Meinshausen
,
Hélène Frémont
,
Kirsten Weide-Zaage
Microelectron. Reliab., 2012

2011
Migration induced material transport in Cu-Sn IMC and SnAgCu microbumps.
[BibTeX]
[DOI]
Lutz Meinshausen
,
Kirsten Weide-Zaage
,
Hélène Frémont
Microelectron. Reliab., 2011

Influence of air gaps on the thermal-electrical-mechanical behavior of a copper metallization.
[BibTeX]
[DOI]
Irina Bauer
,
Kirsten Weide-Zaage
,
Lutz Meinshausen
Microelectron. Reliab., 2011


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