M. Argoud

According to our database, M. Argoud authored at least 2 papers between 2013 and 2015.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of five.

2015

Silicon based dry-films evaluation for 2.5D and 3D Wafer-Level system integration improvement.

Amadine Jouve, Y. Sinquin, Arnaud Garnier, M. Daval, Pascal Chausse, M. Argoud, N. Allouti, Laurence Baud, Jérôme Dechamp, R. Franiatte, Séverine Cheramy, H. Kato, K. Kondo

Proceedings of the 2015 International 3D Systems Integration Conference, 2015

2013

Wafer level encapsulated materials evaluation for chip on wafer (CoW) approach in 2.5D Si interposer integration.

Sylvain Joblot, Alexis Farcy, Nicolas Hotellier, Amadine Jouve, François de Crecy, Arnaud Garnier, M. Argoud, C. Ferrandon, J.-P. Colonna, R. Franiatte, C. Laviron, Séverine Cheramy

Proceedings of the 2013 IEEE International 3D Systems Integration Conference (3DIC), 2013