Jean-Philippe Colonna

According to our database, Jean-Philippe Colonna authored at least 11 papers between 2011 and 2017.

Collaborative distances:

• Dijkstra number of four.
• Erdős number of four.

2017

Transistor Temperature Deviation Analysis in Monolithic 3D Standard Cells.

Melanie Brocard, Benoît Mathieu, Jean-Philippe Colonna, Cristiano Santos, Claire Fenouillet-Béranger, Cao-Minh Vincent Lu, Gerald Cibrario, Laurent Brunet, Perrine Batude, François Andrieu, Sébastien Thuries, Olivier Billoint

Proceedings of the 2017 IEEE Computer Society Annual Symposium on VLSI, 2017

2016

Experimental Insights Into Thermal Dissipation in TSV-Based 3-D Integrated Circuits.

Perceval Coudrain, Papa Momar Souare, Rafael Prieto, Vincent Fiori, Alexis Farcy, Laurent Le Pailleur, Jean-Philippe Colonna, Cristiano Santos, Pascal Vivet, M. Haykel Ben Jamaa, Denis Dutoit, François de Crecy, Sylvain Dumas, Christian Chancel, Didier Lattard, Séverine Cheramy

IEEE Des. Test, 2016

Thermal performance of CoolCube™ monolithic and TSV-based 3D integration processes.

Cristiano Santos, Pascal Vivet, Sébastien Thuries, Olivier Billoint, Jean-Philippe Colonna, Perceval Coudrain, Lee Wang

Proceedings of the 2016 IEEE International 3D Systems Integration Conference, 2016

Heat spreading packaging solutions for hybrid bonded 3D-ICs.

Rafael Prieto, Perceval Coudrain, Jean-Philippe Colonna, Y. Hallez, Christian Chancel, V. Rat, Sylvain Dumas, G. Romano, R. Franiatte, C. Brunet-Manquiat, Séverine Cheramy, Alexis Farcy

Proceedings of the 2016 IEEE International 3D Systems Integration Conference, 2016

2015

Graphite-based heat spreaders for hotspot mitigation in 3D ICs.

Cristiano Santos, Rafael Prieto, Pascal Vivet, Jean-Philippe Colonna, Perceval Coudrain, Ricardo Reis

Proceedings of the 2015 International 3D Systems Integration Conference, 2015

2014

Thermal performance of 3D ICs: Analysis and alternatives.

Cristiano Santos, Pascal Vivet, Jean-Philippe Colonna, Perceval Coudrain, Ricardo Augusto da Luz Reis

Proceedings of the 2014 International 3D Systems Integration Conference, 2014

Using TSVs for thermal mitigation in 3D circuits: Wish and truth.

Cristiano Santos, Papa Momar Souare, François de Crecy, Perceval Coudrain, Jean-Philippe Colonna, Pascal Vivet, Andras Borbely, Ricardo Reis, M. Haykel Ben Jamaa, Vincent Fiori, Alexis Farcy

Proceedings of the 2014 International 3D Systems Integration Conference, 2014

2013

Thermal correlation between measurements and FEM simulations in 3D ICs.

Papa Momar Souare, François de Crecy, Vincent Fiori, M. Haykel Ben Jamaa, Alexis Farcy, Sébastien Gallois-Garreignot, Andras Borbely, Jean-Philippe Colonna, Perceval Coudrain, B. Giraud, C. Laviron, Séverine Cheramy, Clément Tavernier, Jean Michailos

Proceedings of the 2013 IEEE International 3D Systems Integration Conference (3DIC), 2013

Which interconnects for which 3D applications? Status and perspectives.

Yann Lamy, Jean-Philippe Colonna, G. Simon, Patrick Leduc, Séverine Cheramy, C. Laviron

Proceedings of the 2013 IEEE International 3D Systems Integration Conference (3DIC), 2013

Wafer level encapsulated materials evaluation for chip on wafer (CoW) approach in 2.5D Si interposer integration.

Sylvain Joblot, Alexis Farcy, Nicolas Hotellier, Amadine Jouve, François de Crecy, Arnaud Garnier, M. Argoud, C. Ferrandon, J.-P. Colonna, R. Franiatte, C. Laviron, Séverine Cheramy

Proceedings of the 2013 IEEE International 3D Systems Integration Conference (3DIC), 2013

2011

3D integration demonstration of a wireless product with design partitioning.

G. Druais, Pascal Ancey, C. Aumont, V. Caubet, Laurent-Luc Chapelon, C. Chaton, Séverine Cheramy, S. Cordova, E. Cirot, Jean-Philippe Colonna, Perceval Coudrain, T. Divel, Y. Dodo, Alexis Farcy, N. Guitard, K. Haxaire, Nicolas Hotellier, F. Leverd, R. Liou, Jean Michailos, A. Ostrovsky, Sebastien Petitdidier, J. Pruvost, D. Riquet, O. Robin, E. Saugier, Nicolas Sillon

Proceedings of the 2011 IEEE International 3D Systems Integration Conference (3DIC), Osaka, Japan, January 31, 2011