Nicolas Hotellier

According to our database1, Nicolas Hotellier authored at least 4 papers between 2011 and 2015.

Collaborative distances:
  • Dijkstra number2 of five.
  • Erdős number3 of five.

Timeline

Legend:

Book 
In proceedings 
Article 
PhD thesis 
Other 

Links

On csauthors.net:

Bibliography

2015
Thermo-mechanical characterization of passive stress sensors in Si interposer.
Microelectronics Reliability, 2015

2013
Thermo-mechanical study of a 2.5D passive silicon interposer technology: Experimental, numerical and In-Situ stress sensors developments.
Proceedings of the 2013 IEEE International 3D Systems Integration Conference (3DIC), 2013

Wafer level encapsulated materials evaluation for chip on wafer (CoW) approach in 2.5D Si interposer integration.
Proceedings of the 2013 IEEE International 3D Systems Integration Conference (3DIC), 2013

2011
3D integration demonstration of a wireless product with design partitioning.
Proceedings of the 2011 IEEE International 3D Systems Integration Conference (3DIC), Osaka, Japan, January 31, 2011


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