Amadine Jouve

According to our database1, Amadine Jouve authored at least 9 papers between 2009 and 2019.

Collaborative distances:
  • Dijkstra number2 of four.
  • Erdős number3 of four.

Timeline

Legend:

Book 
In proceedings 
Article 
PhD thesis 
Other 

Links

On csauthors.net:

Bibliography

2019
Die to Wafer Direct Hybid Bonding Demonstration with High Alignment Accuracy and Electrical Yields.
Proceedings of the 2019 International 3D Systems Integration Conference (3DIC), 2019

Towards a Complete Direct Hybrid Bonding D2W Integration Flow: Known-Good-Dies and Die Planarization Modules Development.
Proceedings of the 2019 International 3D Systems Integration Conference (3DIC), 2019

2018
Fine pitch 3D interconnections with hybrid bonding technology: From process robustness to reliability.
Proceedings of the IEEE International Reliability Physics Symposium, 2018

2016

Towards high density 3D interconnections.
Proceedings of the 2016 IEEE International 3D Systems Integration Conference, 2016

2015
3D advanced integration technology for heterogeneous systems.
Proceedings of the 2015 International 3D Systems Integration Conference, 2015

Silicon based dry-films evaluation for 2.5D and 3D Wafer-Level system integration improvement.
Proceedings of the 2015 International 3D Systems Integration Conference, 2015

2013
Wafer level encapsulated materials evaluation for chip on wafer (CoW) approach in 2.5D Si interposer integration.
Proceedings of the 2013 IEEE International 3D Systems Integration Conference (3DIC), 2013

2009
Material improvement for ultrathin-wafer handling in TSV creation and PECVD process.
Proceedings of the IEEE International Conference on 3D System Integration, 2009


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