M. D. Arafat Kabir

According to our database, M. D. Arafat Kabir authored at least 7 papers between 2020 and 2023.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of four.

2023

FPGA Processor In Memory Architectures (PIMs): Overlay or Overhaul ?

M. D. Arafat Kabir, Ehsan Kabir, Joshua Hollis, Eli Levy-Mackay, Atiyehsadat Panahi, Jason D. Bakos, Miaoqing Huang, David Andrews

Proceedings of the 33rd International Conference on Field-Programmable Logic and Applications, 2023

Making BRAMs Compute: Creating Scalable Computational Memory Fabric Overlays.

M. D. Arafat Kabir, Joshua Hollis, Atiyehsadat Panahi, Jason D. Bakos, Miaoqing Huang, David Andrews

Proceedings of the 31st IEEE Annual International Symposium on Field-Programmable Custom Computing Machines, 2023

2021

Holistic and In-Context Design Flow for 2.5D Chiplet-Package Interaction Co-Optimization.

M. D. Arafat Kabir, Weishiun Hung, Tsung-Yi Ho, Yarui Peng

Proceedings of the International Symposium on VLSI Design, Automation and Test, 2021

Cross-Boundary Inductive Timing Optimization for 2.5D Chiplet-Package Co-Design.

M. D. Arafat Kabir, Dusan Petranovic, Yarui Peng

Proceedings of the GLSVLSI '21: Great Lakes Symposium on VLSI 2021, 2021

2020

Holistic 2.5D Chiplet Design Flow: A 65nm Shared-Block Microcontroller Case Study.

M. D. Arafat Kabir, Yarui Peng

Proceedings of the 33rd IEEE International System-on-Chip Conference, 2020

Coupling Extraction and Optimization for Heterogeneous 2.5D Chiplet-Package Co-Design.

M. D. Arafat Kabir, Dusan Petranovic, Yarui Peng

Proceedings of the IEEE/ACM International Conference On Computer Aided Design, 2020

Chiplet-Package Co-Design For 2.5D Systems Using Standard ASIC CAD Tools.

M. D. Arafat Kabir, Yarui Peng

Proceedings of the 25th Asia and South Pacific Design Automation Conference, 2020