M. D. Arafat Kabir

According to our database1, M. D. Arafat Kabir authored at least 12 papers between 2020 and 2026.

Collaborative distances:
  • Dijkstra number2 of four.
  • Erdős number3 of four.

Timeline

Legend:

Book  In proceedings  Article  PhD thesis  Dataset  Other 

Links

Online presence:

On csauthors.net:

Bibliography

2026
Adaptive Redistribution Layer Routing for Chiplet-Package Co-Design in 2.5D System.
ACM Trans. Design Autom. Electr. Syst., May, 2026

2025
DA-VinCi: A Deep-Learning Accelerator Overlay Using In-Memory Computing.
ACM Trans. Reconfigurable Technol. Syst., December, 2025

2024
Famous: Flexible Accelerator for the Attention Mechanism of Transformer on Ultrascale+ FPGAs.
Proceedings of the International Conference on Field Programmable Technology, 2024

IMAGine: An In-Memory Accelerated GEMV Engine Overlay.
Proceedings of the 34th International Conference on Field-Programmable Logic and Applications, 2024

The BRAM is the Limit: Shattering Myths, Shaping Standards, and Building Scalable PIM Accelerators.
Proceedings of the 32nd IEEE Annual International Symposium on Field-Programmable Custom Computing Machines, 2024

2023
FPGA Processor In Memory Architectures (PIMs): Overlay or Overhaul ?
Proceedings of the 33rd International Conference on Field-Programmable Logic and Applications, 2023

Making BRAMs Compute: Creating Scalable Computational Memory Fabric Overlays.
Proceedings of the 31st IEEE Annual International Symposium on Field-Programmable Custom Computing Machines, 2023

2021
Holistic and In-Context Design Flow for 2.5D Chiplet-Package Interaction Co-Optimization.
Proceedings of the International Symposium on VLSI Design, Automation and Test, 2021

Cross-Boundary Inductive Timing Optimization for 2.5D Chiplet-Package Co-Design.
Proceedings of the GLSVLSI '21: Great Lakes Symposium on VLSI 2021, 2021

2020
Holistic 2.5D Chiplet Design Flow: A 65nm Shared-Block Microcontroller Case Study.
Proceedings of the 33rd IEEE International System-on-Chip Conference, 2020

Coupling Extraction and Optimization for Heterogeneous 2.5D Chiplet-Package Co-Design.
Proceedings of the IEEE/ACM International Conference On Computer Aided Design, 2020

Chiplet-Package Co-Design For 2.5D Systems Using Standard ASIC CAD Tools.
Proceedings of the 25th Asia and South Pacific Design Automation Conference, 2020


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