Yarui Peng

According to our database, Yarui Peng authored at least 19 papers between 2004 and 2022.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of four.

2022

Design Challenges of Intrachiplet and Interchiplet Interconnection.

Chixiao Chen, Jieming Yin, Yarui Peng, Maurizio Palesi, Wenxu Cao, Letian Huang, Amit Kumar Singh, Haocong Zhi, Xiaohang Wang

IEEE Des. Test, 2022

2021

Holistic and In-Context Design Flow for 2.5D Chiplet-Package Interaction Co-Optimization.

M. D. Arafat Kabir, Weishiun Hung, Tsung-Yi Ho, Yarui Peng

Proceedings of the International Symposium on VLSI Design, Automation and Test, 2021

Hierarchical Layout Synthesis and Optimization Framework for High-Density Power Module Design Automation.

Imam Al Razi, Quang Le, H. Alan Mantooth, Yarui Peng

Proceedings of the IEEE/ACM International Conference On Computer Aided Design, 2021

Cross-Boundary Inductive Timing Optimization for 2.5D Chiplet-Package Co-Design.

M. D. Arafat Kabir, Dusan Petranovic, Yarui Peng

Proceedings of the GLSVLSI '21: Great Lakes Symposium on VLSI 2021, 2021

2020

Holistic 2.5D Chiplet Design Flow: A 65nm Shared-Block Microcontroller Case Study.

M. D. Arafat Kabir, Yarui Peng

Proceedings of the 33rd IEEE International System-on-Chip Conference, 2020

Coupling Extraction and Optimization for Heterogeneous 2.5D Chiplet-Package Co-Design.

M. D. Arafat Kabir, Dusan Petranovic, Yarui Peng

Proceedings of the IEEE/ACM International Conference On Computer Aided Design, 2020

Chiplet-Package Co-Design For 2.5D Systems Using Standard ASIC CAD Tools.

M. D. Arafat Kabir, Yarui Peng

Proceedings of the 25th Asia and South Pacific Design Automation Conference, 2020

2017

Design Methodologies for Low-Power 3-D ICs With Advanced Tier Partitioning.

Moongon Jung, Taigon Song, Yarui Peng, Sung Kyu Lim

IEEE Trans. Very Large Scale Integr. Syst., 2017

2016

Full-Chip Signal Integrity Analysis and Optimization of 3-D ICs.

Taigon Song, Chang Liu, Yarui Peng, Sung Kyu Lim

IEEE Trans. Very Large Scale Integr. Syst., 2016

2015

Multi-TSV and E-Field Sharing Aware Full-chip Extraction and Mitigation of TSV-to-Wire Coupling.

Yarui Peng, Dusan Petranovic, Sung Kyu Lim

IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 2015

Full-chip Inter-die Parasitic Extraction in Face-to-Face-Bonded 3D ICs.

Yarui Peng, Taigon Song, Dusan Petranovic, Sung Kyu Lim

Proceedings of the IEEE/ACM International Conference on Computer-Aided Design, 2015

Design, packaging, and architectural policy co-optimization for DC power integrity in 3D DRAM.

Yarui Peng, Bon Woong Ku, Youn-Sik Park, Kwang-Il Park, Seong-Jin Jang, Joo-Sun Choi, Sung Kyu Lim

Proceedings of the 52nd Annual Design Automation Conference, 2015

2014

Silicon Effect-Aware Full-Chip Extraction and Mitigation of TSV-to-TSV Coupling.

Yarui Peng, Taigon Song, Dusan Petranovic, Sung Kyu Lim

IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 2014

Fast and Accurate Full-chip Extraction and Optimization of TSV-to-Wire Coupling.

Yarui Peng, Dusan Petranovic, Sung Kyu Lim

Proceedings of the 51st Annual Design Automation Conference 2014, 2014

On Enhancing Power Benefits in 3D ICs: Block Folding and Bonding Styles Perspective.

Moongon Jung, Taigon Song, Yang Wan, Yarui Peng, Sung Kyu Lim

Proceedings of the 51st Annual Design Automation Conference 2014, 2014

2013

Design and analysis of ultra low power processors using sub/near-threshold 3D stacked ICs.

Sandeep Kumar Samal, Yarui Peng, Yang Zhang, Sung Kyu Lim

Proceedings of the International Symposium on Low Power Electronics and Design (ISLPED), 2013

On accurate full-chip extraction and optimization of TSV-to-TSV coupling elements in 3D ICs.

Yarui Peng, Taigon Song, Dusan Petranovic, Sung Kyu Lim

Proceedings of the IEEE/ACM International Conference on Computer-Aided Design, 2013

Full-chip multiple TSV-to-TSV coupling extraction and optimization in 3D ICs.

Taigon Song, Chang Liu, Yarui Peng, Sung Kyu Lim

Proceedings of the 50th Annual Design Automation Conference 2013, 2013

2004

A Framework of Total Performance Improvement and Transaction Cost-driven Business Process Outsourcing Strategy.

Yarui Peng, Wenhua Hou

Proceedings of the Pacific Asia Conference on Information Systems, 2004