Yarui Peng

According to our database1, Yarui Peng authored at least 13 papers between 2004 and 2020.

Collaborative distances:
  • Dijkstra number2 of four.
  • Erdős number3 of four.

Timeline

Legend:

Book 
In proceedings 
Article 
PhD thesis 
Other 

Links

On csauthors.net:

Bibliography

2020
Chiplet-Package Co-Design For 2.5D Systems Using Standard ASIC CAD Tools.
Proceedings of the 25th Asia and South Pacific Design Automation Conference, 2020

2017
Design Methodologies for Low-Power 3-D ICs With Advanced Tier Partitioning.
IEEE Trans. Very Large Scale Integr. Syst., 2017

2016
Full-Chip Signal Integrity Analysis and Optimization of 3-D ICs.
IEEE Trans. Very Large Scale Integr. Syst., 2016

2015
Multi-TSV and E-Field Sharing Aware Full-chip Extraction and Mitigation of TSV-to-Wire Coupling.
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 2015

Full-chip Inter-die Parasitic Extraction in Face-to-Face-Bonded 3D ICs.
Proceedings of the IEEE/ACM International Conference on Computer-Aided Design, 2015

Design, packaging, and architectural policy co-optimization for DC power integrity in 3D DRAM.
Proceedings of the 52nd Annual Design Automation Conference, 2015

2014
Silicon Effect-Aware Full-Chip Extraction and Mitigation of TSV-to-TSV Coupling.
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 2014

Fast and Accurate Full-chip Extraction and Optimization of TSV-to-Wire Coupling.
Proceedings of the 51st Annual Design Automation Conference 2014, 2014

On Enhancing Power Benefits in 3D ICs: Block Folding and Bonding Styles Perspective.
Proceedings of the 51st Annual Design Automation Conference 2014, 2014

2013
Design and analysis of ultra low power processors using sub/near-threshold 3D stacked ICs.
Proceedings of the International Symposium on Low Power Electronics and Design (ISLPED), 2013

On accurate full-chip extraction and optimization of TSV-to-TSV coupling elements in 3D ICs.
Proceedings of the IEEE/ACM International Conference on Computer-Aided Design, 2013

Full-chip multiple TSV-to-TSV coupling extraction and optimization in 3D ICs.
Proceedings of the 50th Annual Design Automation Conference 2013, 2013

2004
A Framework of Total Performance Improvement and Transaction Cost-driven Business Process Outsourcing Strategy.
Proceedings of the Pacific Asia Conference on Information Systems, 2004


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