Ming-Ji Dai

According to our database, Ming-Ji Dai authored at least 3 papers between 2018 and 2022.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of four.

2022

An Embedded Multi-Die Active Bridge (EMAB) Chip for Rapid-Prototype Programmable 2.5D/3D Packaging Technology.

Jie Zhang, Wei Lu, Po-Tsang Huang, Sih-Han Li, Tsung-Yi Hung, Shih-Hsien Wu, Ming-Ji Dai, I-Shan Chung, Wen-Chao Chen, Chin-Hung Wang, Shyh-Shyuan Sheu, Hung-Ming Chen, Kuan-Neng Chen, Wei-Chung Lo, Chih-I Wu

Proceedings of the IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits 2022), 2022

Image Blending Methods for Defective PCB Image Generation.

Ting-Hui Chiang, Chun-Hao Chang, Li-Hsin Chen, Chun-Ju Lin, An-Chun Luo, Yu-Shan Deng, Po-Han Chang, Ming-Ji Dai, Yu-Chee Tseng

Proceedings of the IEEE International Conference on Consumer Electronics - Taiwan, 2022

2018

Building an Automatic Defect Verification System Using Deep Neural Network for PCB Defect Classification.

Yu-Shan Deng, An-Chun Luo, Ming-Ji Dai

Proceedings of the 4th International Conference on Frontiers of Signal Processing, 2018