Shih-Hsien Wu

According to our database, Shih-Hsien Wu authored at least 3 papers between 2022 and 2025.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of four.

2025

On Efficient Crosstalk Predictability for Fanout Package Designs.

Chung-Yu Hsieh, Hung-Ming Chen, Shih-Hsien Wu, Chien-Ming Hsu, Wei-Hung Liu

Proceedings of the 38th IEEE International System-on-Chip Conference, 2025

2023

Reshaping System Design in 3D Integration: Perspectives and Challenges.

Hung-Ming Chen, Chu-Wen Ho, Shih-Hsien Wu, Wei Lu, Po-Tsang Huang, Hao-Ju Chang, Chien-Nan Jimmy Liu

Proceedings of the 2023 International Symposium on Physical Design, 2023

2022

An Embedded Multi-Die Active Bridge (EMAB) Chip for Rapid-Prototype Programmable 2.5D/3D Packaging Technology.

Jie Zhang, Wei Lu, Po-Tsang Huang, Sih-Han Li, Tsung-Yi Hung, Shih-Hsien Wu, Ming-Ji Dai, I-Shan Chung, Wen-Chao Chen, Chin-Hung Wang, Shyh-Shyuan Sheu, Hung-Ming Chen, Kuan-Neng Chen, Wei-Chung Lo, Chih-I Wu

Proceedings of the IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits 2022), 2022