Oliver Aubel

According to our database, Oliver Aubel authored at least 7 papers between 2006 and 2014.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of five.

2014

A quantitative study of Phosphorous implantation damage on the thick gate oxide of the 28 nm node.

Xinggong Wan, Sandhya Chandrashekhar, Boris Bayha, Martin Trentzsch, Torben Balzer, Mahesh Siddabathula, Oliver Aubel

Microelectron. Reliab., 2014

Robust Electromigration reliability through engineering optimization.

Wee Loon Ng, Kheng Chok Tee, Junfeng Liu, Yong Chiang Ee, Oliver Aubel, Chuan Seng Tan, Kin Leong Pey

Microelectron. Reliab., 2014

Empirical BEOL-TDDB evaluation based on I(t)-trace analysis.

Oliver Aubel, Armand Beyer, Georg Talut, Martin Gall

Microelectron. Reliab., 2014

2009

Investigation of stress distribution in via bottom of Cu-via structures with different via form by means of submodeling.

Joharsyah Ciptokusumo, Kirsten Weide-Zaage, Oliver Aubel

Microelectron. Reliab., 2009

2008

Determination of migration effects in Cu-via structures with respect to process-induced stress.

Kirsten Weide-Zaage, Jiani Zhao, Joharsyah Ciptokusumo, Oliver Aubel

Microelectron. Reliab., 2008

Simulation of migration effects in nanoscaled copper metallizations.

Kirsten Weide-Zaage, Farzan Kashanchi, Oliver Aubel

Microelectron. Reliab., 2008

2006

Investigation of the influence of thermal treatment on interconnect-barrier interfaces in copper metallization systems.

Oliver Aubel, Eberhard Bugiel, Dietmar Krüger, Wolfgang Hasse, Martina Hommel

Microelectron. Reliab., 2006