Paul Kirsch

According to our database, Paul Kirsch authored at least 5 papers between 2008 and 2013.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of four.

2013

Connecting RRAM performance to the properties of the hafnia-based dielectrics.

Gennadi Bersuker, Brian Butcher, David Gilmer, Paul Kirsch, Luca Larcher, Andrea Padovani

Proceedings of the European Solid-State Device Research Conference, 2013

2012

Emerging CMOS and beyond CMOS technologies for an ultra-low power 3D world.

Chang Yong Kang, K. W. Ang, R. Hill, W. Y. Loh, Jungwoo Oh, Rinus Lee, David Gilmer, Gennadi Bersuker, C. Hobbs, Paul Kirsch, Klaus Hummler, S. Arkalgud, Raj Jammy

Proceedings of the IEEE International Conference on IC Design & Technology, 2012

2011

High Transport Si/SiGe Heterostructures for CMOS Transistors with Orientation and Strain Enhanced Mobility.

Jungwoo Oh, Jeff Huang, Injo Ok, Se-Hoon Lee, Paul D. Kirsch, Raj Jammy, Hi-Deok Lee

IEICE Trans. Electron., 2011

2010

Memory overview and RRAM materials development at SEMATECH.

Paul Kirsch

Proceedings of the 2010 IEEE Hot Chips 22 Symposium, Stanford, CA, USA, August 22-24, 2010, 2010

2008

A novel approach to characterization of progressive breakdown in high-k/metal gate stacks.

R. Pagano, Salvatore Lombardo, Felix Palumbo, Paul Kirsch, S. A. Krishnan, Chadwin D. Young, Rino Choi, Gennadi Bersuker, James H. Stathis

Microelectron. Reliab., 2008