Ryuichi Sugie

According to our database, Ryuichi Sugie authored at least 3 papers between 2013 and 2015.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of four.

2015

Characterization of stress distribution in ultra-thinned DRAM wafer.

Tomoji Nakamura, Yoriko Mizushima, Young-Suk Kim, Ryuichi Sugie, Takayuki Ohba

Proceedings of the 2015 International 3D Systems Integration Conference, 2015

Electrical investigation of Cu pumping in through-silicon vias for BEOL reliability in 3D integration.

Chuan-An Cheng, Ryuichi Sugie, Tomoyuki Uchida, Kou-Hua Chen, Chi-Tsung Chiu, Kuan-Neng Chen

Proceedings of the 2015 International 3D Systems Integration Conference, 2015

2013

Influence of wafer thinning process on backside damage in 3D integration.

Tadao Nakamura, Yoriko Mizushima, Hideki Kitada, Young-Suk Kim, Nobuhide Maeda, Shoichi Kodama, Ryuichi Sugie, Hiroshi Hashimoto, Akihito Kawai, Kazuhisa Arai, Akira Uedono, Takayuki Ohba

Proceedings of the 2013 IEEE International 3D Systems Integration Conference (3DIC), 2013