Patrick Justison

According to our database1, Patrick Justison authored at least 9 papers between 2015 and 2023.

Collaborative distances:
  • Dijkstra number2 of four.
  • Erdős number3 of four.

Timeline

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Links

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Bibliography

2023
Self-aligned Fiber Attach on Monolithic Silicon Photonic Chips: Moisture Effect and Hermetic Seal.
Proceedings of the Optical Fiber Communications Conference and Exhibition, 2023

2019
Novel Oxide Top-Off Process Enabling Reliable PC-CA TDDB on IO Devices with Self Aligned Contact.
Proceedings of the IEEE International Reliability Physics Symposium, 2019

A Comprehensive Wafer Level Reliability Study on 65nm Silicon Interposer.
Proceedings of the IEEE International Reliability Physics Symposium, 2019

2018
New insight on TDDB area scaling methodology of non-Poisson systems.
Proceedings of the IEEE International Reliability Physics Symposium, 2018

Reliability challenges for 2.5D/3D integration: An overview.
Proceedings of the IEEE International Reliability Physics Symposium, 2018

Effect of metal line width on electromigration of BEOL Cu interconnects.
Proceedings of the IEEE International Reliability Physics Symposium, 2018

2015
An investigation of process dependence of porous IMD TDDB.
Proceedings of the IEEE International Reliability Physics Symposium, 2015

Impact of electrode surface modulation on time-dependent dielectric breakdown.
Proceedings of the IEEE International Reliability Physics Symposium, 2015

An investigation of dielectric thickness scaling on BEOL TDDB.
Proceedings of the IEEE International Reliability Physics Symposium, 2015


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