Shanyi Li

According to our database, Shanyi Li authored at least 4 papers between 2024 and 2026.

Collaborative distances:

• Dijkstra number of four.
• Erdős number of four.

2026

HiePlace: Efficient Hierarchical PCB Placement.

Shanyi Li, Zhen Zhuang, Mingyu Liu, Weihua Sheng, Bei Yu, Tsung-Yi Ho

IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., January, 2026

IDDA-3D: Inter-Die Delay Aware Timing-Driven Placement on Face-to-Face Bonded 3D ICs.

Zixian Yang, Shanyi Li, Leilei Jin, Tsung-Yi Ho, Chien-Nan Jimmy Liu

Proceedings of the 2026 International Symposium on Physical Design, 2026

2025

MMPack: Multi-Mask Co-Design for Ultra-Large Wafer-Scale Package Integration.

Shanyi Li, Zhen Zhuang, Siyuan Liang, Bei Yu, Tsung-Yi Ho

Proceedings of the IEEE/ACM International Conference On Computer Aided Design, 2025

2024

Floorplet: Performance-Aware Floorplan Framework for Chiplet Integration.

Shixin Chen, Shanyi Li, Zhen Zhuang, Su Zheng, Zheng Liang, Tsung-Yi Ho, Bei Yu, Alberto L. Sangiovanni-Vincentelli

IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., June, 2024