Shiv Govind Singh
Orcid: 0000-0001-7319-879X
According to our database1,
Shiv Govind Singh
authored at least 47 papers
between 2009 and 2024.
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Bibliography
2024
Benchmarking of Multi-Bridge-Channel FETs Toward Analog and Mixed-Mode Circuit Applications.
IEEE Access, 2024
2023
An Android Based Portable Biosensor System for Cardiac Risk-Stratification by Detecting HFABP in Human Plasma.
Proceedings of the 2023 IEEE SENSORS, Vienna, Austria, October 29 - Nov. 1, 2023, 2023
2022
Silk Piezoelectric Tactile Sensors: The Way Forward to Developing Intelligent Implantable Sensors.
Proceedings of the IEEE International Symposium on Circuits and Systems, 2022
2021
A Novel Down Conversion Mixer with Low/High Band Re-configurable Transconductance Amplifier in 65nm CMOS Process.
Proceedings of the 12th IEEE Latin America Symposium on Circuits and System, 2021
2018
Modeling and Fabrication Aspects of PVDF as a Membrane Material for Air Borne PMUT Applications.
Proceedings of the 2018 IEEE SENSORS, New Delhi, India, October 28-31, 2018, 2018
Proceedings of the 2018 IEEE SENSORS, New Delhi, India, October 28-31, 2018, 2018
Exploring the Piezoelectric Property of Electrospun Silk Nanofibers for Sensing Applications.
Proceedings of the 2018 IEEE SENSORS, New Delhi, India, October 28-31, 2018, 2018
Selective Anisotropic Dry Etching of Piezoelectric Silk Microstructures Using Oxygen Plasma Ashing.
Proceedings of the 2018 IEEE SENSORS, New Delhi, India, October 28-31, 2018, 2018
2017
Optimal Don't Care Filling for Minimizing Peak Toggles During At-Speed Stuck-At Testing.
ACM Trans. Design Autom. Electr. Syst., 2017
Source localization via aermod-based simulation under mean squared error criterion: Demonstration using field data.
Proceedings of the 2017 IEEE International Geoscience and Remote Sensing Symposium, 2017
Electrospun polyaniline nanofiber based chemiresistive nanobiosensor platform for DNA Hybridization detection.
Proceedings of the 2017 IEEE SENSORS, Glasgow, United Kingdom, October 29, 2017
Proceedings of the 2017 European Conference on Circuit Theory and Design, 2017
2016
Ultrasensitive, Label Free, Chemiresistive Nanobiosensor Using Multiwalled Carbon Nanotubes Embedded Electrospun SU-8 Nanofibers.
Sensors, 2016
Transient suppression with pseudo error voltage technique for wide supply range automotive DC-DC converters.
Proceedings of the IEEE 59th International Midwest Symposium on Circuits and Systems, 2016
A 1V, -26dBm sensitive auto configurable mixed converter mode RF energy harvesting with wide input range.
Proceedings of the IEEE International Symposium on Circuits and Systems, 2016
A low-cost multi-phase 3A buck converter with improved ripple cancellation for wide supply range.
Proceedings of the IEEE International Symposium on Circuits and Systems, 2016
Proceedings of the 2016 IEEE SENSORS, Orlando, FL, USA, October 30 - November 3, 2016, 2016
Proceedings of the 2016 IEEE SENSORS, Orlando, FL, USA, October 30 - November 3, 2016, 2016
Proceedings of the 2016 IEEE Asia Pacific Conference on Circuits and Systems, 2016
A compact, resource sharing on-chip soft-start technique for automotive DC-DC converters.
Proceedings of the 2016 IEEE Asia Pacific Conference on Circuits and Systems, 2016
Analysis of graphene and CNT based finned TTSV and spreaders for thermal management in 3D IC.
Proceedings of the 2016 IEEE International 3D Systems Integration Conference, 2016
Improved noise coupling performance using optimized Teflon liner with different TSV structures for 3D IC integration.
Proceedings of the 2016 IEEE International 3D Systems Integration Conference, 2016
Low temperature CMOS compatible Cu-Cu thermo-compression bonding with constantan alloy passivation for 3D IC integration.
Proceedings of the 2016 IEEE International 3D Systems Integration Conference, 2016
Noise performance improvement through optimized stacked layer of liner structure around the TSV in 3D IC.
Proceedings of the 2016 IEEE International 3D Systems Integration Conference, 2016
Novel inter layer dielectric and thermal TSV material for enhanced heat mitigation in 3-D IC.
Proceedings of the 2016 IEEE International 3D Systems Integration Conference, 2016
2015
A -30 dBm sensitive ultra low power RF energy harvesting front end with an efficiency of 70.1% at -22 dBm.
Proceedings of the 28th IEEE International System-on-Chip Conference, 2015
A 1.2V wide-band reconfigurable mixer for wireless application in 65nm CMOS technology.
Proceedings of the 28th IEEE International System-on-Chip Conference, 2015
Proceedings of the Nordic Circuits and Systems Conference, 2015
A low/high band highly linearized reconfigurable down conversion mixer in 65nm CMOS process.
Proceedings of the Nordic Circuits and Systems Conference, 2015
A 2μW biomedical frontend with ΣΔ ADC for self-powered U-healthcare devices in 0.18μm CMOS technology.
Proceedings of the IEEE 13th International New Circuits and Systems Conference, 2015
Low power reconfigurable multi-mode LNA utilizing subthreshold bias and low-Q inductors.
Proceedings of the 2015 IEEE International Symposium on Circuits and Systems, 2015
Fabrication of SU-8 based Capacitive Micromachined Ultrasonic Transducer for low frequency therapeutic applications.
Proceedings of the 37th Annual International Conference of the IEEE Engineering in Medicine and Biology Society, 2015
Proceedings of the 37th Annual International Conference of the IEEE Engineering in Medicine and Biology Society, 2015
DP-fill: a dynamic programming approach to X-filling for minimizing peak test power in scan tests.
Proceedings of the 2015 Design, Automation & Test in Europe Conference & Exhibition, 2015
Proceedings of the 2015 International 3D Systems Integration Conference, 2015
Long term efficacy of ultra-thin Ti passivation layer for achieving low temperature, low pressure Cu-Cu Wafer-on-Wafer bonding.
Proceedings of the 2015 International 3D Systems Integration Conference, 2015
2014
Proceedings of the 2014 27th International Conference on VLSI Design, 2014
Efficient Dual Band RF Energy Harvesting Front End for Ultra Low Power Sensitive Passive Wearable Devices.
Proceedings of the 2014 Fifth International Symposium on Electronic System Design, 2014
A low pull-in SU-8 based Capacitive Micromachined Ultrasonic Transducer for medical imaging applications.
Proceedings of the 36th Annual International Conference of the IEEE Engineering in Medicine and Biology Society, 2014
2012
Proceedings of the 20th IEEE/IFIP International Conference on VLSI and System-on-Chip, 2012
Proceedings of the 55th IEEE International Midwest Symposium on Circuits and Systems, 2012
Proceedings of the IEEE Computer Society Annual Symposium on VLSI, 2012
A 1.5-7.5GHz low power low noise amplifier (LNA) design using subthreshold technique for Wireless Sensor Network (WSN) application.
Proceedings of the 2012 IEEE International Symposium on Circuits and Systems, 2012
Proceedings of the IEEE International Conference on Ultra-Wideband, 2012
A reconfigurable aperture coupled microstrip patch antenna with beam steering capability on silicon.
Proceedings of the IEEE Asia Pacific Conference on Circuits and Systems, 2012
2009
Impact of thermal through silicon via (TTSV) on the temperature profile of multi-layer 3-D device stack.
Proceedings of the IEEE International Conference on 3D System Integration, 2009
Achieving low temperature Cu to Cu diffusion bonding with self assembly monolayer (SAM) passivation.
Proceedings of the IEEE International Conference on 3D System Integration, 2009