Steve Lipa

According to our database, Steve Lipa authored at least 14 papers between 2001 and 2022.

Collaborative distances:

• Dijkstra number of four.
• Erdős number of four.

2022

Design Obfuscation Through 3-D Split Fabrication With Smart Partitioning.

Theodros Nigussie, Joshua Schabel, Steve Lipa, Lisa G. McIlrath, Robert Patti, Paul D. Franzon

IEEE Trans. Very Large Scale Integr. Syst., 2022

2019

Vertical Stack Thermal Characterization of Heterogeneous Integration and Packages.

T. Robert Harris, W. Rhett Davis, Steven Lipa, W. Shepherd Pitts, Paul D. Franzon

Proceedings of the 2019 International 3D Systems Integration Conference (3DIC), 2019

2017

H3 (Heterogeneity in 3D): A Logic-on-Logic 3D-Stacked Heterogeneous Multi-Core Processor.

Vinesh Srinivasan, Rangeen Basu Roy Chowdhury, Elliott Forbes, Randy Widialaksono, Zhenqian Zhang, Joshua Schabel, Sungkwan Ku, Steve Lipa, Eric Rotenberg, W. Rhett Davis, Paul D. Franzon

Proceedings of the 2017 IEEE International Conference on Computer Design, 2017

2016

Physical design of a 3D-stacked heterogeneous multi-core processor.

Randy Widialaksono, Rangeen Basu Roy Chowdhury, Zhenqian Zhang, Joshua Schabel, Steve Lipa, Eric Rotenberg, W. Rhett Davis, Paul D. Franzon

Proceedings of the 2016 IEEE International 3D Systems Integration Conference, 2016

2015

Under 100-cycle thread migration latency in a single-ISA heterogeneous multi-core processor.

Elliott Forbes, Zhenqian Zhang, Randy Widialaksono, Brandon H. Dwiel, Rangeen Basu Roy Chowdhury, Vinesh Srinivasan, Steve Lipa, Eric Rotenberg, W. Rhett Davis, Paul D. Franzon

Proceedings of the 2015 IEEE Hot Chips 27 Symposium (HCS), 2015

Computing in 3D.

Paul D. Franzon, Eric Rotenberg, James Tuck, W. Rhett Davis, Huiyang Zhou, Joshua Schabel, Zhenqian Zhang, J. Brandon Dwiel, Elliott Forbes, Joonmoo Huh, Steve Lipa

Proceedings of the 2015 IEEE Custom Integrated Circuits Conference, 2015

Computing in 3D.

Paul D. Franzon, Eric Rotenberg, James Tuck, W. Rhett Davis, Huiyang Zhou, Joshua Schabel, Zhenqian Zhang, J. Brandon Dwiel, Elliott Forbes, Joonmoo Huh, Marcus Tshibangu, Steve Lipa

Proceedings of the 2015 International 3D Systems Integration Conference, 2015

2014

3D-enabled customizable embedded computer (3DECC).

Paul D. Franzon, Eric Rotenberg, James Tuck, Huiyang Zhou, W. Rhett Davis, Hongwen Dai, Joonmoo Huh, Sungkwan Ku, Steve Lipa, Chao Li, Jong Beom Park, Joshua Schabel

Proceedings of the 2014 International 3D Systems Integration Conference, 2014

2013

Exploring early design tradeoffs in 3DIC.

Paul D. Franzon, Shivam Priyadarshi, Steve Lipa, W. Rhett Davis, Thorlindur Thorolfsson

Proceedings of the 2013 IEEE International Symposium on Circuits and Systems (ISCAS2013), 2013

Rationale for a 3D heterogeneous multi-core processor.

Eric Rotenberg, Brandon H. Dwiel, Elliott Forbes, Zhenqian Zhang, Randy Widialaksono, Rangeen Basu Roy Chowdhury, Nyunyi M. Tshibangu, Steve Lipa, W. Rhett Davis, Paul D. Franzon

Proceedings of the 2013 IEEE 31st International Conference on Computer Design, 2013

2012

A 10.35 mW/GFlop stacked SAR DSP unit using fine-grain partitioned 3D integration.

Thorlindur Thorolfsson, Steve Lipa, Paul D. Franzon

Proceedings of the IEEE 2012 Custom Integrated Circuits Conference, 2012

2010

The NCSU Tezzaron design kit.

Steve Lipa, Thorlindur Thorolfsson, Paul D. Franzon

Proceedings of the IEEE International Conference on 3D System Integration, 2010

2008

Design and CAD for 3D integrated circuits.

Paul D. Franzon, W. Rhett Davis, Michael B. Steer, Steve Lipa, Eun Chu Oh, Thorlindur Thorolfsson, Samson Melamed, Sonali Luniya, Tad Doxsee, Stephen Berkeley, Ben Shani, Kurt Obermiller

Proceedings of the 45th Design Automation Conference, 2008

2001

Rotary traveling-wave oscillator arrays: a new clock technology.

John Wood, Terence C. Edwards, Steve Lipa

IEEE J. Solid State Circuits, 2001