William Rhett Davis

IEEE Des. Test, February, 2023

2021

Fast and Accurate PPA Modeling with Transfer Learning.

[BibT_eX]

[DOI]

Luis Francisco

Proceedings of the 3rd ACM/IEEE Workshop on Machine Learning for CAD, 2021

An Instruction-Level Power and Energy Model for the Rocket Chip Generator.

[BibT_eX]

[DOI]

Zhiping Wang

Proceedings of the IEEE/ACM International Symposium on Low Power Electronics and Design, 2021

Fast and Accurate PPA Modeling with Transfer Learning.

[BibT_eX]

[DOI]

Proceedings of the IEEE/ACM International Conference On Computer Aided Design, 2021

A Virtual Platform for Object Detection Systems.

[BibT_eX]

[DOI]

Qianli Zhao

Proceedings of the IEEE International 3D Systems Integration Conference, 2021

2020

Development of a Predictive Process Design kit for15-nm FinFETs: FreePDK15.

[BibT_eX]

[DOI]

Kirti Bhanushali

Chinmay Tembe

CoRR, 2020

Design Rule Checking with a CNN Based Feature Extractor.

[BibT_eX]

[DOI]

Proceedings of the MLCAD '20: 2020 ACM/IEEE Workshop on Machine Learning for CAD, 2020

How to write a compact reliability model with the Open Model Interface (OMI).

[BibT_eX]

[DOI]

Colin Shaw

Ahmed Ramadan Hassan

Proceedings of the 2020 IEEE International Reliability Physics Symposium, 2020

2019

3-D-DATE: A Circuit-Level Three-Dimensional DRAM Area, Timing, and Energy Model.

[BibT_eX]

[DOI]

Jong Beom Park

IEEE Trans. Circuits Syst. I Regul. Pap., 2019

Estimating Pareto Optimum Fronts to Determine Knob Settings in Electronic Design Automation Tools.

[BibT_eX]

[DOI]

Billy Huggins

Proceedings of the 20th International Symposium on Quality Electronic Design, 2019

Characterization of Fast, Accurate Leakage Power Models for IEEE P2416.

[BibT_eX]

[DOI]

Barkha Gupta

Proceedings of the 20th International Symposium on Quality Electronic Design, 2019

Vertical Stack Thermal Characterization of Heterogeneous Integration and Packages.

[BibT_eX]

[DOI]

Proceedings of the 2019 International 3D Systems Integration Conference (3DIC), 2019

2017

H3 (Heterogeneity in 3D): A Logic-on-Logic 3D-Stacked Heterogeneous Multi-Core Processor.

[BibT_eX]

[DOI]

Vinesh Srinivasan

Proceedings of the 2017 IEEE International Conference on Computer Design, 2017

2016

Physical design of a 3D-stacked heterogeneous multi-core processor.

[BibT_eX]

[DOI]

Randy Widialaksono

Proceedings of the 2016 IEEE International 3D Systems Integration Conference, 2016

2015

FreePDK15: An Open-Source Predictive Process Design Kit for 15nm FinFET Technology.

[BibT_eX]

[DOI]

Kirti Bhanushali

Proceedings of the 2015 Symposium on International Symposium on Physical Design, ISPD 2015, Monterey, CA, USA, March 29, 2015

Under 100-cycle thread migration latency in a single-ISA heterogeneous multi-core processor.

[BibT_eX]

[DOI]

Proceedings of the 2015 IEEE Hot Chips 27 Symposium (HCS), 2015

Computing in 3D.

[BibT_eX]

[DOI]

Proceedings of the 2015 IEEE Custom Integrated Circuits Conference, 2015

Thermal simulation of heterogeneous GaN/ InP/silicon 3DIC stacks.

[BibT_eX]

[DOI]

Proceedings of the 2015 International 3D Systems Integration Conference, 2015

Computing in 3D.

[BibT_eX]

[DOI]

Proceedings of the 2015 International 3D Systems Integration Conference, 2015

2014

Pathfinder3D: A framework for exploring early thermal tradeoffs in 3DIC.

[BibT_eX]

[DOI]

Shivam Priyadarshi

Proceedings of the 2014 IEEE International Conference on IC Design & Technology, 2014

Towards a standard flow for system level power modeling.

[BibT_eX]

[DOI]

Nagu R. Dhanwada

Jerry Frenkil

Proceedings of the IEEE/ACM International Conference on Computer-Aided Design, 2014

Leveraging 3D-IC for on-chip timing uncertainty measurements.

[BibT_eX]

[DOI]

Proceedings of the 2014 International 3D Systems Integration Conference, 2014

Thermal effects of heterogeneous interconnects on InP / GaN / Si diverse integrated circuits.

[BibT_eX]

[DOI]

Proceedings of the 2014 International 3D Systems Integration Conference, 2014

3D-enabled customizable embedded computer (3DECC).

[BibT_eX]

[DOI]

Proceedings of the 2014 International 3D Systems Integration Conference, 2014

2013

Hetero<sup>2</sup> 3D integration: A scheme for optimizing efficiency/cost of Chip Multiprocessors.

[BibT_eX]

[DOI]

Proceedings of the International Symposium on Quality Electronic Design, 2013

Exploring early design tradeoffs in 3DIC.

[BibT_eX]

[DOI]

Proceedings of the 2013 IEEE International Symposium on Circuits and Systems (ISCAS2013), 2013

Rationale for a 3D heterogeneous multi-core processor.

[BibT_eX]

[DOI]

Proceedings of the 2013 IEEE 31st International Conference on Computer Design, 2013

Design of controller for L2 cache mapped in Tezzaron stacked DRAM.

[BibT_eX]

[DOI]

Proceedings of the 2013 IEEE International 3D Systems Integration Conference (3DIC), 2013

2012

Area-Efficient Antenna-Scalable MIMO Detector for K-best Sphere Decoding.

[BibT_eX]

[DOI]

Patrick Chiang

J. Signal Process. Syst., 2012

Parallel Transient Simulation of Multiphysics Circuits Using Delay-Based Partitioning.

[BibT_eX]

[DOI]

Shivam Priyadarshi

Christopher S. Saunders

IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 2012

Junction-Level Thermal Analysis of 3-D Integrated Circuits Using High Definition Power Blurring.

[BibT_eX]

[DOI]

IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 2012

Dynamic electrothermal simulation of three-dimensional integrated circuits using standard cell macromodels.

[BibT_eX]

[DOI]

Shivam Priyadarshi

T. Robert Harris

Carlos Tadeo Ortega Otero

Nikhil Kriplani

Carlos E. Christoffersen

IET Circuits Devices Syst., 2012

Leakage Power Contributor Modeling.

[BibT_eX]

[DOI]

IEEE Des. Test Comput., 2012

2011

Design and Computer Aided Design of 3DIC.

[BibT_eX]

[DOI]

Proceedings of the 3D Integration for NoC-based SoC Architectures, 2011

3D specific systems design and CAD.

[BibT_eX]

[DOI]

Proceedings of the 2011 International Conference on Embedded Computer Systems: Architectures, 2011

An energy-efficient 64-QAM MIMO detector for emerging wireless standards.

[BibT_eX]

[DOI]

Joseph Crop

Patrick Chiang

Proceedings of the Design, Automation and Test in Europe, 2011

Pathfinder 3D: A flow for system-level design space exploration.

[BibT_eX]

[DOI]

Proceedings of the 2011 IEEE International 3D Systems Integration Conference (3DIC), Osaka, Japan, January 31, 2011

Coordinating 3D designs: Interface IP, standards or free form?

[BibT_eX]

[DOI]

Proceedings of the 2011 IEEE International 3D Systems Integration Conference (3DIC), Osaka, Japan, January 31, 2011

2010

Low-Power Hypercube Divided Memory FFT Engine Using 3D Integration.

[BibT_eX]

[DOI]

ACM Trans. Design Autom. Electr. Syst., 2010

Algorithm and hardware complexity reduction techniques for k-best sphere decoders.

[BibT_eX]

[DOI]

Proceedings of the 20th ACM Great Lakes Symposium on VLSI 2009, 2010

A low-area flexible MIMO detector for WiFi/WiMAX standards.

[BibT_eX]

[DOI]

Proceedings of the Design, Automation and Test in Europe, 2010

Creating 3D specific systems: Architecture, design and CAD.

[BibT_eX]

[DOI]

Proceedings of the Design, Automation and Test in Europe, 2010

2009

Automated Design Space Exploration for DSP Applications.

[BibT_eX]

[DOI]

J. Signal Process. Syst., 2009

Application Exploration for 3-D Integrated Circuits: TCAM, FIFO, and FFT Case Studies.

[BibT_eX]

[DOI]

IEEE Trans. Very Large Scale Integr. Syst., 2009

High-throughput low-complexity MIMO detector based on K-best algorithm.

[BibT_eX]

[DOI]

Proceedings of the 19th ACM Great Lakes Symposium on VLSI 2009, 2009

The benefits of 3D networks-on-chip as shown with LDPC decoding.

[BibT_eX]

[DOI]

Christopher Mineo

Proceedings of the IEEE International Conference on 3D System Integration, 2009

Junction-level thermal extraction and simulation of 3DICs.

[BibT_eX]

[DOI]

Proceedings of the IEEE International Conference on 3D System Integration, 2009

Delay analysis and design exploration for 3D SRAM.

[BibT_eX]

[DOI]

Xi Chen

Proceedings of the IEEE International Conference on 3D System Integration, 2009

2008

Design and CAD for 3D integrated circuits.

[BibT_eX]

[DOI]

Proceedings of the 45th Design Automation Conference, 2008

Inter-die signaling in three dimensional integrated circuits.

[BibT_eX]

[DOI]

Proceedings of the IEEE 2008 Custom Integrated Circuits Conference, 2008

2007

FreePDK: An Open-Source Variation-Aware Design Kit.

[BibT_eX]

[DOI]

Proceedings of the IEEE International Conference on Microelectronic Systems Education, 2007

An architecture for energy efficient sphere decoding.

[BibT_eX]

[DOI]

Ravi Jenkal

Proceedings of the 2007 International Symposium on Low Power Electronics and Design, 2007

2006

Architecture for Energy Efficient Sphere Decoding.

[BibT_eX]

[DOI]

Proceedings of the 2006 IEEE International SOC Conference, Austin, Texas, USA, 2006

Automated Architectural Exploration for Signal Processing Algorithms.

[BibT_eX]

[DOI]

Proceedings of the IEEE Workshop on Signal Processing Systems, 2006

Exploring compromises among timing, power and temperature in three-dimensional integrated circuits.

[BibT_eX]

[DOI]

Proceedings of the 43rd Design Automation Conference, 2006

2005

Demystifying 3D ICs: The Pros and Cons of Going Vertical.

[BibT_eX]

[DOI]

IEEE Des. Test Comput., 2005

2004

Multi-Parameter Power Minimization of Synthesized Datapaths.

[BibT_eX]

[DOI]

Ambarish M. Sule

Hao Hua

Proceedings of the 2004 IEEE Computer Society Annual Symposium on VLSI (ISVLSI 2004), 2004

2003

A 500-Mb/s soft-output Viterbi decoder.

[BibT_eX]

[DOI]

IEEE J. Solid State Circuits, 2003

Getting High-Performance Silicon from System-Level Design.

[BibT_eX]

[DOI]