William Rhett Davis
Orcid: 0000-0002-9338-1441
According to our database1,
William Rhett Davis
authored at least 63 papers
between 2001 and 2024.
Collaborative distances:
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Bibliography
2024
Proceedings of the International Conference on Artificial Intelligence and Statistics, 2024
2023
IEEE Des. Test, February, 2023
2021
Proceedings of the 3rd ACM/IEEE Workshop on Machine Learning for CAD, 2021
Proceedings of the IEEE/ACM International Symposium on Low Power Electronics and Design, 2021
Proceedings of the IEEE/ACM International Conference On Computer Aided Design, 2021
Proceedings of the IEEE International 3D Systems Integration Conference, 2021
2020
CoRR, 2020
Proceedings of the MLCAD '20: 2020 ACM/IEEE Workshop on Machine Learning for CAD, 2020
Proceedings of the 2020 IEEE International Reliability Physics Symposium, 2020
2019
IEEE Trans. Circuits Syst. I Regul. Pap., 2019
Estimating Pareto Optimum Fronts to Determine Knob Settings in Electronic Design Automation Tools.
Proceedings of the 20th International Symposium on Quality Electronic Design, 2019
Proceedings of the 20th International Symposium on Quality Electronic Design, 2019
Proceedings of the 2019 International 3D Systems Integration Conference (3DIC), 2019
2017
H3 (Heterogeneity in 3D): A Logic-on-Logic 3D-Stacked Heterogeneous Multi-Core Processor.
Proceedings of the 2017 IEEE International Conference on Computer Design, 2017
2016
Proceedings of the 2016 IEEE International 3D Systems Integration Conference, 2016
2015
Proceedings of the 2015 Symposium on International Symposium on Physical Design, ISPD 2015, Monterey, CA, USA, March 29, 2015
Under 100-cycle thread migration latency in a single-ISA heterogeneous multi-core processor.
Proceedings of the 2015 IEEE Hot Chips 27 Symposium (HCS), 2015
Proceedings of the 2015 IEEE Custom Integrated Circuits Conference, 2015
Proceedings of the 2015 International 3D Systems Integration Conference, 2015
Proceedings of the 2015 International 3D Systems Integration Conference, 2015
2014
Proceedings of the 2014 IEEE International Conference on IC Design & Technology, 2014
Proceedings of the IEEE/ACM International Conference on Computer-Aided Design, 2014
Proceedings of the 2014 International 3D Systems Integration Conference, 2014
Thermal effects of heterogeneous interconnects on InP / GaN / Si diverse integrated circuits.
Proceedings of the 2014 International 3D Systems Integration Conference, 2014
Proceedings of the 2014 International 3D Systems Integration Conference, 2014
2013
Hetero<sup>2</sup> 3D integration: A scheme for optimizing efficiency/cost of Chip Multiprocessors.
Proceedings of the International Symposium on Quality Electronic Design, 2013
Proceedings of the 2013 IEEE International Symposium on Circuits and Systems (ISCAS2013), 2013
Proceedings of the 2013 IEEE 31st International Conference on Computer Design, 2013
Proceedings of the 2013 IEEE International 3D Systems Integration Conference (3DIC), 2013
2012
J. Signal Process. Syst., 2012
Parallel Transient Simulation of Multiphysics Circuits Using Delay-Based Partitioning.
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 2012
Junction-Level Thermal Analysis of 3-D Integrated Circuits Using High Definition Power Blurring.
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 2012
Dynamic electrothermal simulation of three-dimensional integrated circuits using standard cell macromodels.
IET Circuits Devices Syst., 2012
2011
Proceedings of the 3D Integration for NoC-based SoC Architectures, 2011
Proceedings of the 2011 International Conference on Embedded Computer Systems: Architectures, 2011
Proceedings of the Design, Automation and Test in Europe, 2011
Proceedings of the 2011 IEEE International 3D Systems Integration Conference (3DIC), Osaka, Japan, January 31, 2011
Proceedings of the 2011 IEEE International 3D Systems Integration Conference (3DIC), Osaka, Japan, January 31, 2011
2010
ACM Trans. Design Autom. Electr. Syst., 2010
Proceedings of the 20th ACM Great Lakes Symposium on VLSI 2009, 2010
Proceedings of the Design, Automation and Test in Europe, 2010
Proceedings of the Design, Automation and Test in Europe, 2010
2009
J. Signal Process. Syst., 2009
Application Exploration for 3-D Integrated Circuits: TCAM, FIFO, and FFT Case Studies.
IEEE Trans. Very Large Scale Integr. Syst., 2009
Proceedings of the 19th ACM Great Lakes Symposium on VLSI 2009, 2009
Proceedings of the IEEE International Conference on 3D System Integration, 2009
Proceedings of the IEEE International Conference on 3D System Integration, 2009
Proceedings of the IEEE International Conference on 3D System Integration, 2009
2008
Proceedings of the 45th Design Automation Conference, 2008
Proceedings of the IEEE 2008 Custom Integrated Circuits Conference, 2008
2007
Proceedings of the IEEE International Conference on Microelectronic Systems Education, 2007
Proceedings of the 2007 International Symposium on Low Power Electronics and Design, 2007
2006
Proceedings of the 2006 IEEE International SOC Conference, Austin, Texas, USA, 2006
Proceedings of the IEEE Workshop on Signal Processing Systems, 2006
Exploring compromises among timing, power and temperature in three-dimensional integrated circuits.
Proceedings of the 43rd Design Automation Conference, 2006
2005
IEEE Des. Test Comput., 2005
2004
Proceedings of the 2004 IEEE Computer Society Annual Symposium on VLSI (ISVLSI 2004), 2004
2003
Proceedings of the 2003 IEEE Computer Society Annual Symposium on VLSI (ISVLSI 2003), 2003
2002
A design environment for high-throughput low-power dedicated signal processing systems.
IEEE J. Solid State Circuits, 2002
2001
A design environment for high throughput, low power dedicated signal processing systems.
Proceedings of the IEEE 2001 Custom Integrated Circuits Conference, 2001