Sunkyu Kong

According to our database, Sunkyu Kong authored at least 6 papers between 2013 and 2015.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of five.

2015

TSV-based current probing structure using magnetic coupling in 2.5D and 3D IC.

Jonghoon J. Kim, Daniel H. Jung, Heegon Kim, Sunkyu Kong, Sumin Choi, Jaemin Lim, Joungho Kim

Proceedings of the 10th International Workshop on the Electromagnetic Compatibility of Integrated Circuits, 2015

2014

Magnetically-coupled current probing structure consisting of TSVs and RDLs in 2.5D and 3D ICs.

Jonghoon J. Kim, Bumhee Bae, Sukjin Kim, Sunkyu Kong, Heegon Kim, Daniel H. Jung, Joungho Kim

Proceedings of the 2014 International 3D Systems Integration Conference, 2014

2013

Coil Design and Shielding Methods for a Magnetic Resonant Wireless Power Transfer System.

Jiseong Kim, Jonghoon J. Kim, Sunkyu Kong, Hongseok Kim, In-Soo Suh, Nam Pyo Suh, Dong-Ho Cho, Joungho Kim, Seungyoung Ahn

Proc. IEEE, 2013

Design of contactless wafer-level TSV connectivity testing structure using capacitive coupling.

Jonghoon J. Kim, Heegon Kim, Sukjin Kim, Bumhee Bae, Daniel H. Jung, Sunkyu Kong, Joungho Kim, Junho Lee, Kunwoo Park

Proceedings of the 9th International Workshop on Electromagnetic Compatibility of Integrated Circuits, 2013

Magnetic field coupling on analog-to-digital converter from wireless power transfer system in automotive environment.

Bumhee Bae, Sunkyu Kong, Jonghoon J. Kim, Sukjin Kim, Joungho Kim

Proceedings of the 9th International Workshop on Electromagnetic Compatibility of Integrated Circuits, 2013

Non-contact wafer-level TSV connectivity test methodology using magnetic coupling.

Jonghoon J. Kim, Heegon Kim, Sukjin Kim, Bumhee Bae, Daniel H. Jung, Sunkyu Kong, Joungho Kim, Junho Lee, Kunwoo Park

Proceedings of the 2013 IEEE International 3D Systems Integration Conference (3DIC), 2013