Jonghoon J. Kim

According to our database¹, Jonghoon J. Kim authored at least 16 papers between 2013 and 2021.

Collaborative distances:

Dijkstra number² of five.
Erdős number³ of four.

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2021

Industry's First 7.2 Gbps 512GB DDR5 Module.

[BibT_eX]

[DOI]

Proceedings of the IEEE Hot Chips 33 Symposium, 2021

2015

Shielding structures for through silicon via (TSV) to active circuit noise coupling in 3D IC.

[BibT_eX]

[DOI]

Proceedings of the 10th International Workshop on the Electromagnetic Compatibility of Integrated Circuits, 2015

TSV-based current probing structure using magnetic coupling in 2.5D and 3D IC.

[BibT_eX]

[DOI]

Proceedings of the 10th International Workshop on the Electromagnetic Compatibility of Integrated Circuits, 2015

Modeling and analysis of defects in through silicon via channel for non-invasive fault isolation.

[BibT_eX]

[DOI]

Proceedings of the 2015 International 3D Systems Integration Conference, 2015

Crosstalk-included eye-diagram estimation for high-speed silicon, organic, and glass interposer channels on 2.5D/3D IC.

[BibT_eX]

[DOI]

Proceedings of the 2015 International 3D Systems Integration Conference, 2015

2014

Electromagnetic Compatibility of Resonance Coupling Wireless Power Transfer in On-Line Electric Vehicle System.

[BibT_eX]

[DOI]

IEICE Trans. Commun., 2014

Magnetically-coupled current probing structure consisting of TSVs and RDLs in 2.5D and 3D ICs.

[BibT_eX]

[DOI]

Proceedings of the 2014 International 3D Systems Integration Conference, 2014

Fault detection and isolation of multiple defects in through silicon via (TSV) channel.

[BibT_eX]

[DOI]

Proceedings of the 2014 International 3D Systems Integration Conference, 2014

2013

Coil Design and Shielding Methods for a Magnetic Resonant Wireless Power Transfer System.

[BibT_eX]

[DOI]

Proc. IEEE, 2013

Design of contactless wafer-level TSV connectivity testing structure using capacitive coupling.

[BibT_eX]

[DOI]

Proceedings of the 9th International Workshop on Electromagnetic Compatibility of Integrated Circuits, 2013

Design and measurement of a compact on-interposer passive equalizer for chip-to-chip high-speed differential signaling.

[BibT_eX]

[DOI]

Proceedings of the 9th International Workshop on Electromagnetic Compatibility of Integrated Circuits, 2013

Modeling and analysis of open defect in through silicon via (TSV) channel.

[BibT_eX]

[DOI]

Proceedings of the 9th International Workshop on Electromagnetic Compatibility of Integrated Circuits, 2013

Magnetic field coupling on analog-to-digital converter from wireless power transfer system in automotive environment.

[BibT_eX]

[DOI]

Proceedings of the 9th International Workshop on Electromagnetic Compatibility of Integrated Circuits, 2013

Non-contact wafer-level TSV connectivity test methodology using magnetic coupling.

[BibT_eX]

[DOI]

Proceedings of the 2013 IEEE International 3D Systems Integration Conference (3DIC), 2013

Eye-diagram simulation and analysis of a high-speed TSV-based channel.

[BibT_eX]

[DOI]

Proceedings of the 2013 IEEE International 3D Systems Integration Conference (3DIC), 2013

Fault isolation of short defect in through silicon via (TSV) based 3D-IC.

[BibT_eX]

[DOI]

Proceedings of the 2013 IEEE International 3D Systems Integration Conference (3DIC), 2013

Jonghoon J. Kim

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