Joungho Kim

Orcid: 0000-0003-1376-0781

According to our database¹, Joungho Kim authored at least 50 papers between 2005 and 2023.

Collaborative distances:

Dijkstra number² of four.
Erdős number³ of four.

Awards

IEEE Fellow

IEEE Fellow 2016, "For contributions to modeling signal and power integrity in 3D integrated circuits".

Timeline

Legend:

Book

In proceedings

Article

PhD thesis

Dataset

Other

Links

On csauthors.net:

Bibliography

2023

RL4CO: an Extensive Reinforcement Learning for Combinatorial Optimization Benchmark.

[BibT_eX]

[DOI]

CoRR, 2023

Multi-Stripline Redistribution Layer Interposer Channel Design for High Bandwidth Memory Module Considering Via Interconnect.

[BibT_eX]

[DOI]

Proceedings of the 20th International SoC Design Conference, 2023

DevFormer: A Symmetric Transformer for Context-Aware Device Placement.

[BibT_eX]

[DOI]

Proceedings of the International Conference on Machine Learning, 2023

2022

Collaborative Distillation Meta Learning for Simulation Intensive Hardware Design.

[BibT_eX]

[DOI]

CoRR, 2022

Transformer Network-based Reinforcement Learning Method for Power Distribution Network (PDN) Optimization of High Bandwidth Memory (HBM).

[BibT_eX]

[DOI]

CoRR, 2022

2021

Learning Collaborative Policies to Solve NP-hard Routing Problems.

[BibT_eX]

[DOI]

Minsu Kim

Jinkyoo Park

Joungho Kim

Proceedings of the Advances in Neural Information Processing Systems 34: Annual Conference on Neural Information Processing Systems 2021, 2021

2019

Low Leakage Electromagnetic Field Level and High Efficiency Using a Novel Hybrid Loop-Array Design for Wireless High Power Transfer System.

[BibT_eX]

[DOI]

IEEE Trans. Ind. Electron., 2019

Smartwatch Strap Wireless Power Transfer System With Flexible PCB Coil and Shielding Material.

[BibT_eX]

[DOI]

IEEE Trans. Ind. Electron., 2019

2018

EMI Reduction Methods in Wireless Power Transfer System for Drone Electrical Charger Using Tightly Coupled Three-Phase Resonant Magnetic Field.

[BibT_eX]

[DOI]

IEEE Trans. Ind. Electron., 2018

High-Resolution Synthesized Magnetic Field Focusing for RF Barcode Applications.

[BibT_eX]

[DOI]

IEEE Trans. Ind. Electron., 2018

Design of an On-Silicon-Interposer Passive Equalizer for Next Generation High Bandwidth Memory With Data Rate Up To 8 Gb/s.

[BibT_eX]

[DOI]

IEEE Trans. Circuits Syst. I Regul. Pap., 2018

Miniaturized and high-performance RF packages with ultra-thin glass substrates.

[BibT_eX]

[DOI]

Min Suk Kim

Markondeya Raj Pulugurtha

Microelectron. J., 2018

2017

Application of Machine Learning for Optimization of 3-D Integrated Circuits and Systems.

[BibT_eX]

[DOI]

IEEE Trans. Very Large Scale Integr. Syst., 2017

2016

High-Frequency Temperature-Dependent Through-Silicon-Via (TSV) Model and High-Speed Channel Performance for 3-D ICs.

[BibT_eX]

[DOI]

IEEE Des. Test, 2016

Design and analysis of on-interposer active power distribution network for an efficient simultaneous switching noise suppression in 2.5D IC.

[BibT_eX]

[DOI]

Proceedings of the 2016 IEEE International 3D Systems Integration Conference, 2016

2015

Design and Analysis of 3D-MAPS (3D Massively Parallel Processor with Stacked Memory).

[BibT_eX]

[DOI]

IEEE Trans. Computers, 2015

Shielding structures for through silicon via (TSV) to active circuit noise coupling in 3D IC.

[BibT_eX]

[DOI]

Proceedings of the 10th International Workshop on the Electromagnetic Compatibility of Integrated Circuits, 2015

TSV-based current probing structure using magnetic coupling in 2.5D and 3D IC.

[BibT_eX]

[DOI]

Proceedings of the 10th International Workshop on the Electromagnetic Compatibility of Integrated Circuits, 2015

Electrical performance of high bandwidth memory (HBM) interposer channel in terabyte/s bandwidth graphics module.

[BibT_eX]

[DOI]

Proceedings of the 2015 International 3D Systems Integration Conference, 2015

Active Si interposer for 3D IC integrations.

[BibT_eX]

[DOI]

Joungho Kim

Proceedings of the 2015 International 3D Systems Integration Conference, 2015

Modeling and analysis of defects in through silicon via channel for non-invasive fault isolation.

[BibT_eX]

[DOI]

Proceedings of the 2015 International 3D Systems Integration Conference, 2015

Noise coupling modeling and analysis of through glass via(TGV).

[BibT_eX]

[DOI]

Proceedings of the 2015 International 3D Systems Integration Conference, 2015

Crosstalk-included eye-diagram estimation for high-speed silicon, organic, and glass interposer channels on 2.5D/3D IC.

[BibT_eX]

[DOI]

Proceedings of the 2015 International 3D Systems Integration Conference, 2015

2014

Electromagnetic Compatibility of Resonance Coupling Wireless Power Transfer in On-Line Electric Vehicle System.

[BibT_eX]

[DOI]

IEICE Trans. Commun., 2014

Analysis and optimization of a power distribution network in 2.5D IC with glass interposer.

[BibT_eX]

[DOI]

Proceedings of the 2014 International 3D Systems Integration Conference, 2014

Magnetically-coupled current probing structure consisting of TSVs and RDLs in 2.5D and 3D ICs.

[BibT_eX]

[DOI]

Proceedings of the 2014 International 3D Systems Integration Conference, 2014

Fault detection and isolation of multiple defects in through silicon via (TSV) channel.

[BibT_eX]

[DOI]

Proceedings of the 2014 International 3D Systems Integration Conference, 2014

2013

Coil Design and Shielding Methods for a Magnetic Resonant Wireless Power Transfer System.

[BibT_eX]

[DOI]

Proc. IEEE, 2013

Signal integrity design of TSV and interposer in 3D-IC.

[BibT_eX]

[DOI]

Jonghyun Cho

Joungho Kim

Proceedings of the 4th IEEE Latin American Symposium on Circuits and Systems, 2013

Design of contactless wafer-level TSV connectivity testing structure using capacitive coupling.

[BibT_eX]

[DOI]

Proceedings of the 9th International Workshop on Electromagnetic Compatibility of Integrated Circuits, 2013

Design and measurement of a compact on-interposer passive equalizer for chip-to-chip high-speed differential signaling.

[BibT_eX]

[DOI]

Proceedings of the 9th International Workshop on Electromagnetic Compatibility of Integrated Circuits, 2013

Modeling and analysis of open defect in through silicon via (TSV) channel.

[BibT_eX]

[DOI]

Proceedings of the 9th International Workshop on Electromagnetic Compatibility of Integrated Circuits, 2013

Magnetic field coupling on analog-to-digital converter from wireless power transfer system in automotive environment.

[BibT_eX]

[DOI]

Proceedings of the 9th International Workshop on Electromagnetic Compatibility of Integrated Circuits, 2013

Signal integrity modeling and measurement of TSV in 3D IC.

[BibT_eX]

[DOI]

Joohee Kim

Joungho Kim

Proceedings of the 18th Asia and South Pacific Design Automation Conference, 2013

Non-contact wafer-level TSV connectivity test methodology using magnetic coupling.

[BibT_eX]

[DOI]

Proceedings of the 2013 IEEE International 3D Systems Integration Conference (3DIC), 2013

Eye-diagram simulation and analysis of a high-speed TSV-based channel.

[BibT_eX]

[DOI]

Proceedings of the 2013 IEEE International 3D Systems Integration Conference (3DIC), 2013

Fault isolation of short defect in through silicon via (TSV) based 3D-IC.

[BibT_eX]

[DOI]

Proceedings of the 2013 IEEE International 3D Systems Integration Conference (3DIC), 2013

Analysis of glass interposer PDN and proposal of PDN resonance suppression methods.

[BibT_eX]

[DOI]

Proceedings of the 2013 IEEE International 3D Systems Integration Conference (3DIC), 2013

2012

3D-MAPS: 3D Massively parallel processor with stacked memory.

[BibT_eX]

[DOI]

Proceedings of the 2012 IEEE International Solid-State Circuits Conference, 2012

2011

Analysis of TSV-to-TSV coupling with high-impedance termination in 3D ICs.

[BibT_eX]

[DOI]

Proceedings of the 12th International Symposium on Quality Electronic Design, 2011

Full-chip TSV-to-TSV coupling analysis and optimization in 3D IC.

[BibT_eX]

[DOI]

Proceedings of the 48th Design Automation Conference, 2011

2010

Frequency-Dependent Transmission Line Model of a Stranded Coaxial Cable.

[BibT_eX]

[DOI]

IEICE Trans. Electron., 2010

2008

A Delay Line Circuit Design for Crosstalk Minimization Using Genetic Algorithm.

[BibT_eX]

[DOI]

IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 2008

Co-modeling, Experimental Verification, and Analysis of Chip-Package Hierarchical Power Distribution Network.

[BibT_eX]

[DOI]

IEICE Trans. Electron., 2008

Design of a Low-Noise UWB Transceiver SiP.

[BibT_eX]

[DOI]

IEEE Des. Test Comput., 2008

2006

Chip-package hybrid clock distribution network and DLL for low jitter clock delivery.

[BibT_eX]

[DOI]

IEEE J. Solid State Circuits, 2006

Band-Stop Filter Effect of Power/Ground Plane on Through-Hole Signal Via in Multilayer PCB.

[BibT_eX]

[DOI]

IEICE Trans. Electron., 2006

Packaging a 40-Gbps Serial Link Using a Wire-Bonded Plastic Ball Grid Array.

[BibT_eX]

[DOI]

IEEE Des. Test Comput., 2006

2005

Modeling and Measurement of Mode-Conversion and Frequency Dependent Loss in High-Speed Differential Interconnections on Multilayer PCB.

[BibT_eX]

[DOI]

Seungyong Baek

Jingook Kim

Joungho Kim

IEICE Trans. Electron., 2005

Noise generation, coupling, isolation, and EM radiation in high-speed package and PCB.

[BibT_eX]

[DOI]

Proceedings of the International Symposium on Circuits and Systems (ISCAS 2005), 2005

Joungho Kim

Awards

IEEE Fellow

Timeline

Legend:

Links

On csauthors.net:

Bibliography

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