Heegon Kim

According to our database1, Heegon Kim authored at least 32 papers between 2012 and 2020.

Collaborative distances:
  • Dijkstra number2 of five.
  • Erdős number3 of four.

Timeline

Legend:

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Article 
PhD thesis 
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Links

On csauthors.net:

Bibliography

2020
Reinforcement Learning of Graph Neural Networks for Service Function Chaining.
CoRR, 2020

Machine Learning-based Optimal VNF Deployment.
Proceedings of the 21st Asia-Pacific Network Operations and Management Symposium, 2020

Graph Neural Network-based Virtual Network Function Management.
Proceedings of the 21st Asia-Pacific Network Operations and Management Symposium, 2020

Graph Neural Network based Service Function Chaining for Automatic Network Control.
Proceedings of the 21st Asia-Pacific Network Operations and Management Symposium, 2020

2019
Machine Learning-Based Method for Prediction of Virtual Network Function Resource Demands.
Proceedings of the 5th IEEE Conference on Network Softwarization, 2019

A Deep Learning Approach to VNF Resource Prediction using Correlation between VNFs.
Proceedings of the 5th IEEE Conference on Network Softwarization, 2019

Blockchain Explorer based on RPC-based Monitoring System.
Proceedings of the IEEE International Conference on Blockchain and Cryptocurrency, 2019

Predicting VNF Deployment Decisions under Dynamically Changing Network Conditions.
Proceedings of the 15th International Conference on Network and Service Management, 2019

Machine Learning-based Prediction of VNF Deployment Decisions in Dynamic Networks.
Proceedings of the 20th Asia-Pacific Network Operations and Management Symposium, 2019

Machine Learning based Link State Aware Service Function Chaining.
Proceedings of the 20th Asia-Pacific Network Operations and Management Symposium, 2019

2018
Design of an On-Silicon-Interposer Passive Equalizer for Next Generation High Bandwidth Memory With Data Rate Up To 8 Gb/s.
IEEE Trans. Circuits Syst. I Regul. Pap., 2018

2017
Depth-Based Detection of Standing-Pigs in Moving Noise Environments.
Sensors, 2017

Real-time processing for intelligent-surveillance applications.
IEICE Electron. Express, 2017

2016
High-Frequency Temperature-Dependent Through-Silicon-Via (TSV) Model and High-Speed Channel Performance for 3-D ICs.
IEEE Des. Test, 2016

2015
TSV-based current probing structure using magnetic coupling in 2.5D and 3D IC.
Proceedings of the 10th International Workshop on the Electromagnetic Compatibility of Integrated Circuits, 2015

Electrical performance of high bandwidth memory (HBM) interposer channel in terabyte/s bandwidth graphics module.
Proceedings of the 2015 International 3D Systems Integration Conference, 2015

Modeling and analysis of defects in through silicon via channel for non-invasive fault isolation.
Proceedings of the 2015 International 3D Systems Integration Conference, 2015

Crosstalk-included eye-diagram estimation for high-speed silicon, organic, and glass interposer channels on 2.5D/3D IC.
Proceedings of the 2015 International 3D Systems Integration Conference, 2015

2014
CPU-GPU hybrid computing for feature extraction from video stream.
IEICE Electron. Express, 2014

Analysis and optimization of a power distribution network in 2.5D IC with glass interposer.
Proceedings of the 2014 International 3D Systems Integration Conference, 2014

Magnetically-coupled current probing structure consisting of TSVs and RDLs in 2.5D and 3D ICs.
Proceedings of the 2014 International 3D Systems Integration Conference, 2014

Fault detection and isolation of multiple defects in through silicon via (TSV) channel.
Proceedings of the 2014 International 3D Systems Integration Conference, 2014

2013
Parallelizing H.264 and AES Collectively.
KSII Trans. Internet Inf. Syst., 2013

Power-Time Tradeoff of Parallel Execution on Multi-core Platforms.
Proceedings of the Mobile, Ubiquitous, and Intelligent Computing, 2013

Design of contactless wafer-level TSV connectivity testing structure using capacitive coupling.
Proceedings of the 9th International Workshop on Electromagnetic Compatibility of Integrated Circuits, 2013

Design and measurement of a compact on-interposer passive equalizer for chip-to-chip high-speed differential signaling.
Proceedings of the 9th International Workshop on Electromagnetic Compatibility of Integrated Circuits, 2013

Modeling and analysis of open defect in through silicon via (TSV) channel.
Proceedings of the 9th International Workshop on Electromagnetic Compatibility of Integrated Circuits, 2013

Non-contact wafer-level TSV connectivity test methodology using magnetic coupling.
Proceedings of the 2013 IEEE International 3D Systems Integration Conference (3DIC), 2013

Eye-diagram simulation and analysis of a high-speed TSV-based channel.
Proceedings of the 2013 IEEE International 3D Systems Integration Conference (3DIC), 2013

Fault isolation of short defect in through silicon via (TSV) based 3D-IC.
Proceedings of the 2013 IEEE International 3D Systems Integration Conference (3DIC), 2013

2012
Energy Efficient Image/Video Data Transmission on Commercial Multi-Core Processors.
Sensors, 2012

Overcoming Amdahl's Law by Distributing Workload Asymmetrically.
Proceedings of the Convergence and Hybrid Information Technology, 2012


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