Heegon Kim

Orcid: 0000-0003-0728-1346

According to our database¹, Heegon Kim authored at least 41 papers between 2012 and 2023.

Collaborative distances:

Dijkstra number² of four.
Erdős number³ of four.

Timeline

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On csauthors.net:

Bibliography

2023

Automated Detection of Rice Bakanae Disease via Drone Imagery.

[BibT_eX]

[DOI]

Sensors, 2023

Graph neural network-based virtual network function deployment optimization.

[BibT_eX]

[DOI]

Int. J. Netw. Manag., 2023

Network Traffic Prediction and Auto-Scaling of SFC using Temporal Fusion Transformer.

[BibT_eX]

[DOI]

Proceedings of the 24st Asia-Pacific Network Operations and Management Symposium, 2023

2022

Multispectral interaction convolutional neural network for pedestrian detection.

[BibT_eX]

[DOI]

Comput. Vis. Image Underst., 2022

Detecting Ripeness of Strawberry and Coordinates of Strawberry Stalk using Deep Learning.

[BibT_eX]

[DOI]

Proceedings of the Thirteenth International Conference on Ubiquitous and Future Networks, 2022

Updating VNF deployment with Scaling Actions using Reinforcement Algorithms.

[BibT_eX]

[DOI]

Proceedings of the 23rd Asia-Pacific Network Operations and Management Symposium, 2022

Reinforcement Learning of Graph Neural Networks for Service Function Chaining in Computer Network Management.

[BibT_eX]

[DOI]

Proceedings of the 23rd Asia-Pacific Network Operations and Management Symposium, 2022

2021

A Network Intelligence Architecture for Efficient VNF Lifecycle Management.

[BibT_eX]

[DOI]

IEEE Trans. Netw. Serv. Manag., 2021

2020

Reinforcement Learning of Graph Neural Networks for Service Function Chaining.

[BibT_eX]

[DOI]

CoRR, 2020

Graph Neural Network-based Virtual Network Function Deployment Prediction.

[BibT_eX]

[DOI]

Proceedings of the 16th International Conference on Network and Service Management, 2020

Machine Learning-based Optimal VNF Deployment.

[BibT_eX]

[DOI]

Proceedings of the 21st Asia-Pacific Network Operations and Management Symposium, 2020

Graph Neural Network-based Virtual Network Function Management.

[BibT_eX]

[DOI]

Proceedings of the 21st Asia-Pacific Network Operations and Management Symposium, 2020

Graph Neural Network based Service Function Chaining for Automatic Network Control.

[BibT_eX]

[DOI]

Proceedings of the 21st Asia-Pacific Network Operations and Management Symposium, 2020

2019

Machine Learning-Based Method for Prediction of Virtual Network Function Resource Demands.

[BibT_eX]

[DOI]

Proceedings of the 5th IEEE Conference on Network Softwarization, 2019

A Deep Learning Approach to VNF Resource Prediction using Correlation between VNFs.

[BibT_eX]

[DOI]

Proceedings of the 5th IEEE Conference on Network Softwarization, 2019

Blockchain Explorer based on RPC-based Monitoring System.

[BibT_eX]

[DOI]

Proceedings of the IEEE International Conference on Blockchain and Cryptocurrency, 2019

Predicting VNF Deployment Decisions under Dynamically Changing Network Conditions.

[BibT_eX]

[DOI]

Proceedings of the 15th International Conference on Network and Service Management, 2019

Machine Learning-based Prediction of VNF Deployment Decisions in Dynamic Networks.

[BibT_eX]

[DOI]

Proceedings of the 20th Asia-Pacific Network Operations and Management Symposium, 2019

Machine Learning based Link State Aware Service Function Chaining.

[BibT_eX]

[DOI]

Proceedings of the 20th Asia-Pacific Network Operations and Management Symposium, 2019

2018

Design of an On-Silicon-Interposer Passive Equalizer for Next Generation High Bandwidth Memory With Data Rate Up To 8 Gb/s.

[BibT_eX]

[DOI]

IEEE Trans. Circuits Syst. I Regul. Pap., 2018

2017

Depth-Based Detection of Standing-Pigs in Moving Noise Environments.

[BibT_eX]

[DOI]

Sensors, 2017

Real-time processing for intelligent-surveillance applications.

[BibT_eX]

[DOI]

IEICE Electron. Express, 2017

2016

High-Frequency Temperature-Dependent Through-Silicon-Via (TSV) Model and High-Speed Channel Performance for 3-D ICs.

[BibT_eX]

[DOI]

IEEE Des. Test, 2016

2015

TSV-based current probing structure using magnetic coupling in 2.5D and 3D IC.

[BibT_eX]

[DOI]

Proceedings of the 10th International Workshop on the Electromagnetic Compatibility of Integrated Circuits, 2015

Electrical performance of high bandwidth memory (HBM) interposer channel in terabyte/s bandwidth graphics module.

[BibT_eX]

[DOI]

Proceedings of the 2015 International 3D Systems Integration Conference, 2015

Modeling and analysis of defects in through silicon via channel for non-invasive fault isolation.

[BibT_eX]

[DOI]

Proceedings of the 2015 International 3D Systems Integration Conference, 2015

Crosstalk-included eye-diagram estimation for high-speed silicon, organic, and glass interposer channels on 2.5D/3D IC.

[BibT_eX]

[DOI]

Proceedings of the 2015 International 3D Systems Integration Conference, 2015

2014

CPU-GPU hybrid computing for feature extraction from video stream.

[BibT_eX]

[DOI]

IEICE Electron. Express, 2014

Analysis and optimization of a power distribution network in 2.5D IC with glass interposer.

[BibT_eX]

[DOI]

Proceedings of the 2014 International 3D Systems Integration Conference, 2014

Magnetically-coupled current probing structure consisting of TSVs and RDLs in 2.5D and 3D ICs.

[BibT_eX]

[DOI]

Proceedings of the 2014 International 3D Systems Integration Conference, 2014

Fault detection and isolation of multiple defects in through silicon via (TSV) channel.

[BibT_eX]

[DOI]

Proceedings of the 2014 International 3D Systems Integration Conference, 2014

2013

Parallelizing H.264 and AES Collectively.

[BibT_eX]

[DOI]

KSII Trans. Internet Inf. Syst., 2013

Power-Time Tradeoff of Parallel Execution on Multi-core Platforms.

[BibT_eX]

[DOI]

Sungju Lee

Heegon Kim

Yongwha Chung

Proceedings of the Mobile, Ubiquitous, and Intelligent Computing, 2013

Design of contactless wafer-level TSV connectivity testing structure using capacitive coupling.

[BibT_eX]

[DOI]

Proceedings of the 9th International Workshop on Electromagnetic Compatibility of Integrated Circuits, 2013

Design and measurement of a compact on-interposer passive equalizer for chip-to-chip high-speed differential signaling.

[BibT_eX]

[DOI]

Proceedings of the 9th International Workshop on Electromagnetic Compatibility of Integrated Circuits, 2013

Modeling and analysis of open defect in through silicon via (TSV) channel.

[BibT_eX]

[DOI]

Proceedings of the 9th International Workshop on Electromagnetic Compatibility of Integrated Circuits, 2013

Non-contact wafer-level TSV connectivity test methodology using magnetic coupling.

[BibT_eX]

[DOI]

Proceedings of the 2013 IEEE International 3D Systems Integration Conference (3DIC), 2013

Eye-diagram simulation and analysis of a high-speed TSV-based channel.

[BibT_eX]

[DOI]

Proceedings of the 2013 IEEE International 3D Systems Integration Conference (3DIC), 2013

Fault isolation of short defect in through silicon via (TSV) based 3D-IC.

[BibT_eX]

[DOI]

Proceedings of the 2013 IEEE International 3D Systems Integration Conference (3DIC), 2013

2012

Energy Efficient Image/Video Data Transmission on Commercial Multi-Core Processors.

[BibT_eX]

[DOI]

Sensors, 2012

Overcoming Amdahl's Law by Distributing Workload Asymmetrically.

[BibT_eX]

[DOI]

Heegon Kim

Sungju Lee

Yongwha Chung

Proceedings of the Convergence and Hybrid Information Technology, 2012

Heegon Kim

Timeline

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On csauthors.net:

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