Sukjin Kim

According to our database1, Sukjin Kim authored at least 20 papers between 2006 and 2020.

Collaborative distances:
  • Dijkstra number2 of four.
  • Erdős number3 of four.

Timeline

Legend:

Book 
In proceedings 
Article 
PhD thesis 
Other 

Links

On csauthors.net:

Bibliography

2020
Technology Scaling of ESD Devices in State of the Art FinFET Technologies.
Proceedings of the 2020 IEEE Custom Integrated Circuits Conference, 2020

2018
Architectures and algorithms for user customization of CNNs.
Proceedings of the 23rd Asia and South Pacific Design Automation Conference, 2018

2017
Fast cycle-accurate compile based simulator for reconfigurable processor.
Proceedings of the IEEE International Symposium on Circuits and Systems, 2017

A space- and energy-efficient code Compression/Decompression technique for coarse-grained reconfigurable architectures.
Proceedings of the 2017 International Symposium on Code Generation and Optimization, 2017

Incremental training of CNNs for user customization: work-in-progress.
Proceedings of the 2017 International Conference on Compilers, 2017

2016
Improved B-spline image registration between exhale and inhale lung CT images based on intensity and gradient orientation information.
Proceedings of the Medical Imaging 2016: Image Processing, 2016

Intra mode power saving methodology for CGRA-based reconfigurable processor architectures.
Proceedings of the IEEE International Symposium on Circuits and Systems, 2016

2015
Direct display interface including video post-processing for 8K UHD TV.
Proceedings of the IEEE International Conference on Consumer Electronics, 2015

Ultra-low-power voice trigger for wearable devices.
Proceedings of the IEEE International Conference on Consumer Electronics - Taiwan, 2015

Flexible video processing platform for 8K UHD TV.
Proceedings of the 2015 IEEE Hot Chips 27 Symposium (HCS), 2015

Modeling and analysis of defects in through silicon via channel for non-invasive fault isolation.
Proceedings of the 2015 International 3D Systems Integration Conference, 2015

2014
Magnetically-coupled current probing structure consisting of TSVs and RDLs in 2.5D and 3D ICs.
Proceedings of the 2014 International 3D Systems Integration Conference, 2014

Fault detection and isolation of multiple defects in through silicon via (TSV) channel.
Proceedings of the 2014 International 3D Systems Integration Conference, 2014

2013
Design of contactless wafer-level TSV connectivity testing structure using capacitive coupling.
Proceedings of the 9th International Workshop on Electromagnetic Compatibility of Integrated Circuits, 2013

Magnetic field coupling on analog-to-digital converter from wireless power transfer system in automotive environment.
Proceedings of the 9th International Workshop on Electromagnetic Compatibility of Integrated Circuits, 2013

Non-contact wafer-level TSV connectivity test methodology using magnetic coupling.
Proceedings of the 2013 IEEE International 3D Systems Integration Conference (3DIC), 2013

2012
Design space exploration and implementation of a high performance and low area Coarse Grained Reconfigurable Processor.
Proceedings of the 2012 International Conference on Field-Programmable Technology, 2012

2011
An instruction-scheduling-aware data partitioning technique for coarse-grained reconfigurable architectures.
Proceedings of the ACM SIGPLAN/SIGBED 2011 conference on Languages, 2011

2010
Resource recycling: putting idle resources to work on a composable accelerator.
Proceedings of the 2010 International Conference on Compilers, 2010

2006
Hardware and a Tool Chain for ADRES.
Proceedings of the Reconfigurable Computing: Architectures and Applications, 2006


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