Tianshu Hou
Orcid: 0000-0001-5349-1825
  According to our database1,
  Tianshu Hou
  authored at least 12 papers
  between 2020 and 2025.
  
  
Collaborative distances:
Collaborative distances:
Timeline
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Bibliography
  2025
Physics-Informed Learning Based Multiphysics Simulation for Fast Transient TSV Electromigration Analysis.
    
  
    ACM Trans. Design Autom. Electr. Syst., March, 2025
    
  
  2024
    Proceedings of the 29th Asia and South Pacific Design Automation Conference, 2024
    
  
  2023
Analytical Post-Voiding Modeling and Efficient Characterization of EM Failure Effects Under Time-Dependent Current Stressing.
    
  
    IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., December, 2023
    
  
A Deep Learning Framework for Solving Stress-based Partial Differential Equations in Electromigration Analysis.
    
  
    ACM Trans. Design Autom. Electr. Syst., July, 2023
    
  
Toward Compact Transformers for End-to-End Object Detection With Decomposed Chain Tensor Structure.
    
  
    IEEE Trans. Circuits Syst. Video Technol., February, 2023
    
  
Multilayer Perceptron-Based Stress Evolution Analysis Under DC Current Stressing for Multisegment Wires.
    
  
    IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., February, 2023
    
  
    Proceedings of the 15th IEEE International Conference on ASIC, 2023
    
  
  2022
A Space-Time Neural Network for Analysis of Stress Evolution Under DC Current Stressing.
    
  
    IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 2022
    
  
Multilayer Perceptron Based Stress Evolution Analysis under DC Current Stressing for Multi-segment Wires.
    
  
    CoRR, 2022
    
  
FASSST: Fast Attention Based Single-Stage Segmentation Net for Real-Time Instance Segmentation.
    
  
    Proceedings of the IEEE/CVF Winter Conference on Applications of Computer Vision, 2022
    
  
    Proceedings of the Thirty-Sixth AAAI Conference on Artificial Intelligence, 2022
    
  
  2020
Stress Evolution Analysis of EM-Induced Void Growth for Multi-Segment Interconnect Wires.
    
  
    Proceedings of the 2020 IEEE Asia Pacific Conference on Circuits and Systems, 2020