Tianshu Hou

According to our database, Tianshu Hou authored at least 15 papers between 2020 and 2026.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of four.

2026

FastRW: An Efficient Random Walk Method for Steady-State Thermal Analysis.

Zixiao Wang, Tianshu Hou, Chenghan Wang, Zhen Zhuang, Tsung-Yi Ho, Farzan Farnia, Bei Yu

Proceedings of the Design, Automation & Test in Europe Conference, 2026

2025

Novel Partitioning-Based Approach for Electromigration Assessment With Neural Networks.

Tianshu Hou, Farid N. Najm, Ngai Wong, Hai-Bao Chen

IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., December, 2025

Physics-Informed Learning Based Multiphysics Simulation for Fast Transient TSV Electromigration Analysis.

Xiaoman Yang, Haibao Chen, Yuhan Zhang, Tianshu Hou, Pengpeng Ren, Runsheng Wang, Zhigang Ji, Ru Huang

ACM Trans. Design Autom. Electr. Syst., March, 2025

Equivalent Lumped Element Model for Electromigration Considering Thermal Effects.

Hengyi Zhu, Wenjie Zhu, Tianshu Hou, Zhigang Ji, Runsheng Wang, Min Tang, Hai-Bao Chen

Proceedings of the IEEE/ACM International Conference On Computer Aided Design, 2025

2024

Physics-Informed Learning for Versatile RRAM Reset and Retention Simulation.

Tianshu Hou, Yuan Ren, Wenyong Zhou, Can Li, Zhongrui Wang, Hai-Bao Chen, Ngai Wong

Proceedings of the 29th Asia and South Pacific Design Automation Conference, 2024

2023

Analytical Post-Voiding Modeling and Efficient Characterization of EM Failure Effects Under Time-Dependent Current Stressing.

Tianshu Hou, Ngai Wong, Quan Chen, Zhigang Ji, Hai-Bao Chen

IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., December, 2023

A Deep Learning Framework for Solving Stress-based Partial Differential Equations in Electromigration Analysis.

Tianshu Hou, Peining Zhen, Zhigang Ji, Hai-Bao Chen

ACM Trans. Design Autom. Electr. Syst., July, 2023

Toward Compact Transformers for End-to-End Object Detection With Decomposed Chain Tensor Structure.

Peining Zhen, Xiaotao Yan, Wei Wang, Tianshu Hou, Hao Wei, Hai-Bao Chen

IEEE Trans. Circuits Syst. Video Technol., February, 2023

Multilayer Perceptron-Based Stress Evolution Analysis Under DC Current Stressing for Multisegment Wires.

Tianshu Hou, Peining Zhen, Ngai Wong, Quan Chen, Guoyong Shi, Shuqi Wang, Hai-Bao Chen

IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., February, 2023

A Time- and Energy-Efficient CNN with Dense Connections on Memristor-Based Chips.

Wenyong Zhou, Yuan Ren, Jiajun Zhou, Tianshu Hou, Ngai Wong

Proceedings of the 15th IEEE International Conference on ASIC, 2023

2022

A Space-Time Neural Network for Analysis of Stress Evolution Under DC Current Stressing.

Tianshu Hou, Ngai Wong, Quan Chen, Zhigang Ji, Hai-Bao Chen

IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 2022

Multilayer Perceptron Based Stress Evolution Analysis under DC Current Stressing for Multi-segment Wires.

Tianshu Hou, Peining Zhen, Ngai Wong, Quan Chen, Guoyong Shi, Shuqi Wang, Hai-Bao Chen

CoRR, 2022

FASSST: Fast Attention Based Single-Stage Segmentation Net for Real-Time Instance Segmentation.

Yuan Cheng, Rui Lin, Peining Zhen, Tianshu Hou, Chiu Wa Ng, Hai-Bao Chen, Hao Yu, Ngai Wong

Proceedings of the IEEE/CVF Winter Conference on Applications of Computer Vision, 2022

Deeply Tensor Compressed Transformers for End-to-End Object Detection.

Peining Zhen, Ziyang Gao, Tianshu Hou, Yuan Cheng, Hai-Bao Chen

Proceedings of the Thirty-Sixth AAAI Conference on Artificial Intelligence, 2022

2020

Stress Evolution Analysis of EM-Induced Void Growth for Multi-Segment Interconnect Wires.

Zaiyong Liu, Hai-Bao Chen, Tianshu Hou

Proceedings of the 2020 IEEE Asia Pacific Conference on Circuits and Systems, 2020