Tianshu Hou

Orcid: 0000-0001-5349-1825

According to our database1, Tianshu Hou authored at least 10 papers between 2020 and 2023.

Collaborative distances:
  • Dijkstra number2 of five.
  • Erdős number3 of four.

Timeline

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Links

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Bibliography

2023
Analytical Post-Voiding Modeling and Efficient Characterization of EM Failure Effects Under Time-Dependent Current Stressing.
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., December, 2023

A Deep Learning Framework for Solving Stress-based Partial Differential Equations in Electromigration Analysis.
ACM Trans. Design Autom. Electr. Syst., July, 2023

Toward Compact Transformers for End-to-End Object Detection With Decomposed Chain Tensor Structure.
IEEE Trans. Circuits Syst. Video Technol., February, 2023

Multilayer Perceptron-Based Stress Evolution Analysis Under DC Current Stressing for Multisegment Wires.
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., February, 2023

A Time- and Energy-Efficient CNN with Dense Connections on Memristor-Based Chips.
Proceedings of the 15th IEEE International Conference on ASIC, 2023

2022
A Space-Time Neural Network for Analysis of Stress Evolution Under DC Current Stressing.
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 2022

Multilayer Perceptron Based Stress Evolution Analysis under DC Current Stressing for Multi-segment Wires.
CoRR, 2022

FASSST: Fast Attention Based Single-Stage Segmentation Net for Real-Time Instance Segmentation.
Proceedings of the IEEE/CVF Winter Conference on Applications of Computer Vision, 2022

Deeply Tensor Compressed Transformers for End-to-End Object Detection.
Proceedings of the Thirty-Sixth AAAI Conference on Artificial Intelligence, 2022

2020
Stress Evolution Analysis of EM-Induced Void Growth for Multi-Segment Interconnect Wires.
Proceedings of the 2020 IEEE Asia Pacific Conference on Circuits and Systems, 2020


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