Wei Wang

Orcid: 0009-0007-4555-564X

Affiliations:
  • Rice University, Houston, TX, USA


According to our database1, Wei Wang authored at least 13 papers between 2022 and 2025.

Collaborative distances:
  • Dijkstra number2 of five.
  • Erdős number3 of four.

Timeline

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Bibliography

2025
35.4: A Miniature Biomedical Implant Secured by Two-Factor Authentication with Emergency Access.
Proceedings of the IEEE International Solid-State Circuits Conference, 2025

35.2 A Spatial-Domain Compressive-Sensing Photoacoustic Imager with Matrix-Multiplying SAR ADC.
Proceedings of the IEEE International Solid-State Circuits Conference, 2025

A Parallel-Input Energy-Recycling Power Management Unit with Continuous MPPT for Magnetoelectrically Powered mm-Scale Bio-Implants.
Proceedings of the IEEE Custom Integrated Circuits Conference, 2025

RPG-HBC: Reconfigurable Passive Galvanic Human Body Communication for Bioelectronic Implants Under Varying Channel Conditions.
Proceedings of the IEEE Custom Integrated Circuits Conference, 2025

2024
A Miniature Batteryless Bioelectronic Implant Using One Magnetoelectric Transducer for Wireless Powering and PWM Backscatter Communication.
IEEE Trans. Biomed. Circuits Syst., December, 2024

Omnidirectional Wireless Power Transfer for Millimetric Magnetoelectric Biomedical Implants.
IEEE J. Solid State Circuits, November, 2024

A 2×56 Gb/s 0.78-pJ/b PAM-4 Crosstalk Cancellation Receiver With Active Crosstalk Extraction Technique in 28-nm CMOS.
IEEE J. Solid State Circuits, September, 2024

A Miniature Batteryless Bioelectronic Implant Using One Magnetoelectric Transducer for Wireless Powering and PWM Backscatter Communication.
CoRR, 2024

33.6 A Millimetric Batteryless Biosensing and Stimulating Implant with Magnetoelectric Power Transfer and 0.9pJ/b PWM Backscatter.
Proceedings of the IEEE International Solid-State Circuits Conference, 2024

17.1 Omnidirectional Magnetoelectric Power Transfer for Miniaturized Biomedical Implants via Active Echo.
Proceedings of the IEEE International Solid-State Circuits Conference, 2024

2023
Magnetoeletric Backscatter Communication for Millimeter-Sized Wireless Biomedical Implants.
GetMobile Mob. Comput. Commun., March, 2023

A 36nW CMOS Temperature Sensor with <0.1K Inaccuracy and Uniform Resolution.
Proceedings of the 2023 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits), 2023

2022
Magnetoelectric backscatter communication for millimeter-sized wireless biomedical implants.
Proceedings of the ACM MobiCom '22: The 28th Annual International Conference on Mobile Computing and Networking, Sydney, NSW, Australia, October 17, 2022


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