Wei Wang
Orcid: 0009-0007-4555-564XAffiliations:
- Rice University, Houston, TX, USA
According to our database1,
Wei Wang
authored at least 13 papers
between 2022 and 2025.
Collaborative distances:
Collaborative distances:
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Bibliography
2025
35.4: A Miniature Biomedical Implant Secured by Two-Factor Authentication with Emergency Access.
Proceedings of the IEEE International Solid-State Circuits Conference, 2025
35.2 A Spatial-Domain Compressive-Sensing Photoacoustic Imager with Matrix-Multiplying SAR ADC.
Proceedings of the IEEE International Solid-State Circuits Conference, 2025
A Parallel-Input Energy-Recycling Power Management Unit with Continuous MPPT for Magnetoelectrically Powered mm-Scale Bio-Implants.
Proceedings of the IEEE Custom Integrated Circuits Conference, 2025
RPG-HBC: Reconfigurable Passive Galvanic Human Body Communication for Bioelectronic Implants Under Varying Channel Conditions.
Proceedings of the IEEE Custom Integrated Circuits Conference, 2025
2024
A Miniature Batteryless Bioelectronic Implant Using One Magnetoelectric Transducer for Wireless Powering and PWM Backscatter Communication.
IEEE Trans. Biomed. Circuits Syst., December, 2024
Omnidirectional Wireless Power Transfer for Millimetric Magnetoelectric Biomedical Implants.
IEEE J. Solid State Circuits, November, 2024
A 2×56 Gb/s 0.78-pJ/b PAM-4 Crosstalk Cancellation Receiver With Active Crosstalk Extraction Technique in 28-nm CMOS.
IEEE J. Solid State Circuits, September, 2024
A Miniature Batteryless Bioelectronic Implant Using One Magnetoelectric Transducer for Wireless Powering and PWM Backscatter Communication.
CoRR, 2024
33.6 A Millimetric Batteryless Biosensing and Stimulating Implant with Magnetoelectric Power Transfer and 0.9pJ/b PWM Backscatter.
Proceedings of the IEEE International Solid-State Circuits Conference, 2024
17.1 Omnidirectional Magnetoelectric Power Transfer for Miniaturized Biomedical Implants via Active Echo.
Proceedings of the IEEE International Solid-State Circuits Conference, 2024
2023
Magnetoeletric Backscatter Communication for Millimeter-Sized Wireless Biomedical Implants.
GetMobile Mob. Comput. Commun., March, 2023
Proceedings of the 2023 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits), 2023
2022
Magnetoelectric backscatter communication for millimeter-sized wireless biomedical implants.
Proceedings of the ACM MobiCom '22: The 28th Annual International Conference on Mobile Computing and Networking, Sydney, NSW, Australia, October 17, 2022