Yao-Chun Chuang

According to our database, Yao-Chun Chuang authored at least 5 papers between 2016 and 2025.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of five.

2025

CoWoS Package Reliability Risk Assessment & Mitigation from Mechanical Perspectives.

Ching-Ting Liu, Yao-Chun Chuang, Jyun-Lin Wu, Jia-Shen Lan, Chang-Fu Han, Chia-Hua Chang, Jia-Ming Yang, Yu-Sheng Lin, Chen-Wei Li, Ryan Lu

Proceedings of the IEEE International Reliability Physics Symposium, 2025

Characterization of Cu and SiCN Adhesion in BEOL Interconnections.

Chang-Fu Han, Jia-Ming Yang, Chia-Hua Chang, Yu-Sheng Lin, Jyun-Lin Wu, Yao-Chun Chuang, Ryan Lu

Proceedings of the IEEE International Reliability Physics Symposium, 2025

Electromigration Performance of Cu Bumps in Various Configurations.

Jui-Shen Chang, Chung-Yu Chiu, Ching-Ting Liu, Chen-Nan Chiu, Yao-Chun Chuang, Ryan Lu

Proceedings of the IEEE International Reliability Physics Symposium, 2025

2023

Reliability Challenges from 2.5D to 3DIC in Advanced Package Development.

Ryan Lu, Yao-Chun Chuang, Jyun-Lin Wu, Jun He

Proceedings of the IEEE International Reliability Physics Symposium, 2023

2016

A low store energy and robust ReRAM-based flip-flop for normally off microprocessors.

Tsai-Kan Chien, Lih-Yih Chiou, Yao-Chun Chuang, Shyh-Shyuan Sheu, Heng-Yuan Li, Pei-Hua Wang, Tzu-Kun Ku, Ming-Jinn Tsai, Chih-I Wu

Proceedings of the IEEE International Symposium on Circuits and Systems, 2016