K.-Y. Byun

According to our database1, K.-Y. Byun authored at least 2 papers between 2012 and 2013.

Collaborative distances:
  • Dijkstra number2 of five.
  • Erdős number3 of five.

Timeline

Legend:

Book 
In proceedings 
Article 
PhD thesis 
Other 

Links

On csauthors.net:

Bibliography

2013
3D memory chip stacking by multi-layer self-assembly technology.
Proceedings of the 2013 IEEE International 3D Systems Integration Conference (3DIC), 2013

2012
Measurement of stresses in Cu and Si around through-silicon via by synchrotron X-ray microdiffraction for 3-dimensional integrated circuits.
Microelectronics Reliability, 2012


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