According to our database1, K.-Y. Byun authored at least 2 papers between 2012 and 2013.
Legend:Book In proceedings Article PhD thesis Other
3D memory chip stacking by multi-layer self-assembly technology.
Proceedings of the 2013 IEEE International 3D Systems Integration Conference (3DIC), 2013
Measurement of stresses in Cu and Si around through-silicon via by synchrotron X-ray microdiffraction for 3-dimensional integrated circuits.
Microelectronics Reliability, 2012