Ho-Young Son

According to our database, Ho-Young Son authored at least 3 papers between 2012 and 2013.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of five.

2013

3D memory chip stacking by multi-layer self-assembly technology.

Takafumi Fukushima, Jichoel Bea, Mariappan Murugesan, Ho-Young Son, M.-S. Suh, K.-Y. Byun, N.-S. Kim, Kang Wook Lee, Mitsumasa Koyanagi

Proceedings of the 2013 IEEE International 3D Systems Integration Conference (3DIC), 2013

2012

Flexible Chip-on-Flex (COF) and embedded Chip-in-Flex (CIF) packages by applying wafer level package (WLP) technology using anisotropic conductive films (ACFs).

Kyoung-Lim Suk, Ho-Young Son, Chang-Kyu Chung, Joong Do Kim, Jin-Woo Lee, Kyung-Wook Paik

Microelectron. Reliab., 2012

Measurement of stresses in Cu and Si around through-silicon via by synchrotron X-ray microdiffraction for 3-dimensional integrated circuits.

Arief Suriadi Budiman, H.-A.-S. Shin, B.-J. Kim, S.-H. Hwang, Ho-Young Son, Min-Suk Suh, Q.-H. Chung, K.-Y. Byun, Nobumichi Tamura, Martin Kunz, Young-Chang Joo

Microelectron. Reliab., 2012