Andreas Martin

Affiliations:
  • Infineon Technologies AG, Corporate reliability department, Neubiberg, Germany


According to our database1, Andreas Martin authored at least 11 papers between 2001 and 2022.

Collaborative distances:
  • Dijkstra number2 of six.
  • Erdős number3 of five.

Timeline

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Links

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Bibliography

2022
Plasma processing induced charging damage (PID) assessment with appropriate fWLR stress methods ensuring expected MOS reliability and lifetimes for automotive products (Invited).
Proceedings of the IEEE International Reliability Physics Symposium, 2022

2020
A New Implementation Approach for Reliability Design Rules against Plasma Induced Charging Damage from Well Configurations of Complex ICs.
Proceedings of the 2020 IEEE International Reliability Physics Symposium, 2020

2018
Variation-resilient quantifiable plasma process induced damage monitoring.
Microelectron. Reliab., 2018

2016
Degradation and recovery of variability due to BTI.
Microelectron. Reliab., 2016

Fast wafer level reliability monitoring as a tool to achieve automotive quality for a wafer process.
Microelectron. Reliab., 2016

Plasma process induced damage detection by fast wafer level reliability monitoring for automotive applications.
Microelectron. Reliab., 2016

2005
Reliability of gate dielectrics and metal-insulator-metal capacitors.
Microelectron. Reliab., 2005

2004
An introduction to fast wafer level reliability monitoring for integrated circuit mass production.
Microelectron. Reliab., 2004

2003
Ramped current stress for fast and reliable wafer level reliability monitoring of thin gate oxide reliability.
Microelectron. Reliab., 2003

2001
Editorial.
Microelectron. Reliab., 2001

Quality assessment of thin oxides using constant and ramped stress measurements.
Microelectron. Reliab., 2001


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