Bo Pu

According to our database, Bo Pu authored at least 5 papers between 2014 and 2025.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of four.

2025

Survey of Chiplet Technology: SoC Architecture, Interconnect, EDA, and Advanced Packaging.

Hongwei Liu, Yuan Du, Bo Pu, Guojun Yuan, Yuhang Liu, Linji Zheng, Pengchao Wang, An Yang, Yu Li, Chengming Yu, Fei Guo, Xiaoteng Zhao, Xuqiang Zheng, He Sun, Yongfu Li, Shaolin Xiang, Qinfen Hao

IEEE J. Emerg. Sel. Topics Circuits Syst., December, 2025

2023

Electrothermal Responses of Bonding Wire Arrays in GaN Power Amplifier.

Hao Xie, Sichao Du, Bo Pu, Jun Hu, Yu Zhang, Wei Qi, Hong Liu, Shuo Zhang, Duo Xiao

IEEE Access, 2023

2021

Fast PDN Impedance Prediction Using Deep Learning.

Ling Zhang, Jack Juang, Zurab Kiguradze, Bo Pu, Shuai Jin, Songping Wu, Zhiping Yang, Chulsoon Hwang

CoRR, 2021

2019

Parallelizing Convergent Cross Mapping Using Apache Spark.

Bo Pu, Lujie Duan, Nathaniel D. Osgood

Proceedings of the Social, Cultural, and Behavioral Modeling, 2019

2014

Research on high resolution & high sensitivity panoramic surveillance system.

Zhenhai Zhang, Kejie Li, Bo Hu, Bo Pu, Jiyang Li, Zijie Jiang, Mengying Liu, Tao Li, Xudong Liu

Proceedings of the 11th IEEE International Conference on Advanced Video and Signal Based Surveillance, 2014